Introducing the AI chip leading the world in precision scaling
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Introducing the AI chip leading the world in precision scaling
Self-driving cars, text to speech, artificial intelligence (AI) services and delivery drones — just a few obvious applications of AI. To keep fueling the AI gold rush, we’ve been improving the very heart of AI hardware technology: digital AI cores that power deep learning, the key enabler of artificial intelligence.
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After an unpredictable 2020, here’s what to expect for hybrid cloud in 2021
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After an unpredictable 2020, here’s what to expect for hybrid cloud in 2021
A year ago, few businesses could have anticipated the dramatic changes that 2020 had in store for them. By the end of March, the COVID-19 pandemic had disrupted operations worldwide, forcing businesses to quickly adapt their technology infrastructures to accommodate all or most of their workforces remotely and cope with unprecedented levels of long-term uncertainty. For many businesses, re-vamping IT infrastructure has been a key to survival.
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IEDM 2020: Advances in memory, analog AI and interconnects point to the future of hybrid cloud and AI
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IEDM 2020: Advances in memory, analog AI and interconnects point to the future of hybrid cloud and AI
The symbiotic connection between AI and hybrid cloud might not be obvious at first glance, but a closer look reveals important connections between the two—connections that will only strengthen as the technologies mature.
You need AI, for example, to effectively automate the application modernization, business process mapping, and workload migration – to create successful hybrid cloud environments. Hybrid clouds, meanwhile, give businesses the ability to harness the enormous amounts of computing power needed to train increasingly complex AI models, which need a lot of data to generate useful predictions or observations. Hybrid cloud and AI share another common denominator—their growth and maturation depend largely on improvements in systems on which they operate.
This is exactly what we at IBM are working on.
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EUV patterning yield breakthrough sets new benchmark for logic scaling
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EUV patterning yield breakthrough sets new benchmark for logic scaling
IBM has a long history of being at the forefront of patterning advancements that drive semiconductor logic scaling to ever-smaller dimensions in keeping with Moore’s Law. From the invention of the chemically-amplified photoresist, through the early demonstration and adoption of immersion lithography, IBM’s leadership in patterning has spanned decades. This leadership was recently underscored by the announcement of the new POWER10 processor, the latest to enable enterprise-grade Hybrid Cloud compute at three times the previous processor energy efficiency. This ability to shrink transistor patterning to smaller and smaller dimensions, thousands of times thinner than the human hair, is correlated to the wavelength of light used to expose the patterning. These advances provide critical hardware needs for the IBM Hybrid Cloud.
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IBM teams with industry partners to bring energy-efficient AI hardware to hybrid cloud environments
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IBM teams with industry partners to bring energy-efficient AI hardware to hybrid cloud environments
The next generation of computing will define how we respond to crises, by accelerating the analysis of problems and the synthesis of solutions to them. The ability to make advances in AI, in particular, will empower collaborative scientific communities and bring automation and virtually unlimited computing resources to every facet of the scientific process. With the help of AI and the computers that power it, scientists will be able to accelerate and scale scientific discovery at a pace never before seen.
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IBM Systems Research: AI and Hybrid Cloud Can Advance Only as Far as Hardware Can Take Them
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IBM Systems Research: AI and Hybrid Cloud Can Advance Only as Far as Hardware Can Take Them
Even with the advancement of 10, 7 and 5nm chips, the industry is preparing itself for life after silicon. Carbon nanotubes hold promise as the next material for the next generation of computers. IBM researchers developed a technique that could make the technology more viable.
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VLSI 2020: IBM Research Highlights Nanosheet, AI Processor and Photonics Advances
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VLSI 2020: IBM Research Highlights Nanosheet, AI Processor and Photonics Advances
At the 2020 Symposia on VLSI Technology and Circuits this week, IBM Research is presenting a variety of papers, short courses, workshops and virtual sessions that demonstrate the latest advances in systems research. Our research spotlights key developments for hybrid cloud infrastructure and AI, marked by improvements in performance, energy efficiency, area scaling, and new workloads.
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Women in systems research transforming AI hardware
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Women in systems research transforming AI hardware
After 75 years of dramatic advances, the digital computer is bumping against its limits, constrained by its architecture and atomic physics. To continue making smarter, faster and more efficient machines, systems researchers at IBM are pioneering new technologies and approaches. In this blogpost, the fourth in our series dedicated to Women in IBM Research, we meet four scientists—in Japan, Switzerland, California and New York. They’re working to transform computing with AI hardware accelerators, nanosheet technology, and spintronics. The goal is not simply to make smarter machines, but to create deep-learning platforms that help solve our most pressing and intractable problems.
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IBM Research at SPIE 2020: New Architectures and Fabrications for AI Hardware
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IBM Research at SPIE 2020: New Architectures and Fabrications for AI Hardware
In the last decade, IBM has pioneered AI hardware technologies that have produced the top two supercomputers and most-secure enterprise platform in the world. At this year’s SPIE Advanced Lithography conference (February 24-27), IBM Research will continue this tradition of developing pioneering technologies through new research in AI hardware, alongside continued innovation in logic transistor scaling. These advances are part of IBM Research’s mission to deliver leading-edge semiconductor technology that enables future generations of computational systems to handle tomorrow’s needs. IBM Research had 21 papers accepted to SPIE, and throughout the four-day conference IBM researchers will present on topics ranging from EUV lithography, patterning materials, metrology, etch, selective deposition, and novel device integration.
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IBM Research AI Hardware Center marks first birthday with explosive gains in AI computation
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IBM Research AI Hardware Center marks first birthday with explosive gains in AI computation
One year ago, we announced the creation of the IBM Research AI Hardware Center, a global research hub headquartered in Albany, New York. Building on work of the last few years, the launch of the Center initiated the next phase in a long-term effort to combine evolving, fundamental advances in AI with new computing accelerators, technologies, and architectures designed and optimized specifically for AI computation. Launching the Center was our way to invite industrial and academic partners to join us in the development and productization of AI hardware, essential to meeting the computational demands of the emerging broad AI era. Our inherently energy efficient technologies aim to meet the demand for computational power that AI applications and software advances require.
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