A new IBM Research specialization teaches how AI models run on modern accelerators
Technical note
Kaoutar El Maghraoui
What’s Next in Semiconductors
is powering full-stack AI
The way the world computes is shifting. Over the last decade, demand for AI applications has grown exponentially. Pipelines are getting more complex, and the world needs new hardware to train and serve AI at the scale enterprise demands. At IBM Research, we’re building the hardware and the tools to serve cutting-edge AI. We’re pushing the limits of semiconductor design, packaging, and connectivity, with innovations like sub-2 nm node chips, co-packaged optics, the AIU family of chips, and 3D nanosheet transistor technology. We’re building tomorrow’s AI supercomputers from the ground up.
Our work
Preparing chip designers for the nanostack era
ReleasePeter HessMaking AI-driven chip design affordable with open agent factories and distributed inference at scale
NewsPeter HessWhy are silicon wafers round?
ExplainerPeter HessWhat is a nanostack? Building a chip like a city
ExplainerPeter HessIntroducing the first sub-1 nanometer node chip — the smallest, most powerful chip technology in the world
NewsMike Murphy- See more of our work on Semiconductors
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.
Explore the center
Publication collections
IEEE Electronic Components and Technology Conference
26 MaySPIE Advanced Lithography + Patterning
22 FebIEEE International Solid-State Circuits Conference
15 FebIEDM 2025
11
IEEE International Electron Devices Meeting
06 Dec