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A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnectsK. MotoyamaD. Metzleret al.2023IITC/MAM 2023
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Etch and Patterning Development for 2nm Node Nanosheet DevicesEric MillerIndira Seshadriet al.2022SPIE Advanced Lithography 2022
First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache ApplicationsH. WuV. Katragaddaet al.2021IEDM 2021
Significance of plasma-photoresist interactions for atomic layer etching processes with extreme ultraviolet photoresistAdam PrandaKang Yi Linet al.2020JVSTA
Selective atomic layer etching of HfO2 over silicon by precursor and substrate-dependent selective depositionKang Yi LinChen Liet al.2020JVSTA
Simulation of photoresist defect transfer through subsequent patterning processesDominik MetzlerMohamed Oulmaneet al.2020SPIE Advanced Lithography 2020
Exploration of pillar local CDU improvement options for AI applicationsCharlie LiuHao Tanget al.2020SPIE Advanced Lithography 2020
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide linesR. S. SmithE. T. Ryanet al.2019AIP Advances
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