Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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30 results for Semiconductors

A 14 nm embedded STT-MRAM CMOS technology
D. Edelstein, M. Rizzolo, et al.2020IEDM 2020
Topological semimetals for scaled back-end-of-line interconnect beyond Cu
Ching Tzu Chen, Utkarsh Bajpai, et al.2020IEDM 2020
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
Hiroyuki Mori, Sayuri Kohara2021ECTC 2021
Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
Aakrati Jain, Kamal Sikka, et al.2021ECTC 2021
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
Risa Miyazawa, Chinami Marushima, et al.2021ECTC 2021
High Density Multi-Chip Module for Photonic Reservoir Computing
Jean Benoit Heroux, Toshiyuki Yamane, et al.2021ECTC 2021
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
Katsuyuki Sakuma, Dishit Parekh, et al.2021ECTC 2021
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
Kamal Sikka, Ravi Bonam, et al.2021ECTC 2021
Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication
Xiaoxiong Gu, Duixian Liu, et al.2021ECTC 2021
Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
Keiji Matsumoto, Marc Bergendahl, et al.2021ECTC 2021