Publication
IITC 2017
Conference paper

Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics

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Abstract

Recently the mechanical properties of nano-porous ultra-low-k (ULK) dielectric thin films have been characterized by nanoindentation using a tri-layer sample configuration. Tetraethyl orthosilicate (TEOS) silica was coated on the fragile ULK thin film to protect it from direct contact with nanoindenter tip. In this paper, the finite element method (FEM) simulations are conducted to investigate the effect of TEOS thickness, and to propose rules to design the tri-layer sample.

Date

Publication

IITC 2017

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