Bringing quantum-centric supercomputing to Illinois
Q & A
Kim Martineau
AI Hardware
The world is generating reams of data each day, and the AI systems built to make sense of it all constantly need faster and more robust hardware. We’re developing new devices and architectures to support the tremendous processing power AI requires to realize its full potential.
Our work
IBM demonstrates extreme scale for content-aware storage with a 100-billion vector database
NewsPeter HessBuilding PyTorch-native support for the IBM Spyre Accelerator
Technical noteViji Srinivasan, Raghu Ganti, Mudhakar Srivatsa, Elpida Tzortzatos, Tabari Alexander, and Vaidyanathan SrinivasanLifting the cover on the IBM Spyre Accelerator
Technical noteJeffrey BurnsIt takes a village to make open infrastructure for AI a reality
NewsPeter HessExpanding AI model training and inference for the open-source community
NewsPeter Hess- See more of our work on AI Hardware
Projects
Neuro-inspired AI to optimize learning and computing efficiency of next generation AI.
Analog AI: A New Design Paradigm
At IBM Research we’re developing a new class of Analog AI hardware, purpose built to help innovators realize the promise of the next stages of AI. Journey inside this unique architecture.
Publications
Enterprise-Scale RAS in IBM Z Memory Subsystem
- Pat Meaney
- None None
- et al.
- 2026
- DSN 2026
Conference paperVSIMO: A DC-DC SIMO-based Current Mismatch Compensator Supporting Per-Output Bidirectional Power Flow for Stacked Voltage Domains Achieving >82% System Efficiency under up to 360-mA Load Mismatch
- Yichen Xu
- Baoqi Zhu
- et al.
- 2026
- VLSI Technology and Circuits 2026
Conference paperA 1-to-1050-mA DLDO with Rising-Edge Computational Control and Load-Dependent Feedback Achieving 46-mV/ns DVS Rate and 0.15-ps FoM
- Yichen Xu
- Mao Li
- et al.
- 2026
- VLSI Technology and Circuits 2026
Conference paperAdvanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- Yigit Turan
- Xinchen Wang
- et al.
- 2026
- ECTC 2026
PosterHigh-Resolution Nanoscale X-ray Imaging for Non-Destructive Inspection of Copper Grains in Fine-Pitch Pads for Hybrid Bonding
- Nimish Nazirkar
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
Conference paperDirect Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paper
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.
Explore the center