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    Welcome to the
    AI Hardware Center

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    The IBM Research AI Hardware Center is a global research hub headquartered in Albany, New York. The center is focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speed that AI requires to realize its full potential.

    Overview

    Today’s systems have achieved improved AI performance by infusing machine-learning capabilities with high-bandwidth CPUs and GPUs, specialized AI accelerators and high-performance networking equipment. To maintain this trajectory, new thinking is needed to accelerate AI performance scaling to match to ever-expanding AI workload complexities.

    The AI Hardware Center is taking a holistic approach to building AI systems from the ground up – from materials, chips, devices, architecture and the entire software stack. IBM, working with NY State and a broader ecosystem of partners, is paving the way for the next generation of artificial intelligence systems that will improve business and the lives of people all over the world.

    Our researchers also played a pivotal part in creating IBM Cloud Functions, IBM Kubernetes Service, Multicloud Manager and Key Protect, as well as the development and adoption of Istio as an enterprise service mesh. Our teams were also core contributors to the IBM Cloud Gen 2 control plane and SDN.

    Each of these achievements builds upon the last to ensure IBM Cloud users have access to the latest breakthroughs in cloud technology.

    Join IBM and New York State to form a collaboration hub in the IBM Research AI Hardware Center.

    Contact us

    Features

    IBM Telum chip, and IBM z16 sketches.

    • Analog AI Cores

      Analog AI cores enable in-memory storage and processing of data to speed computation and yield exponential gains in computational efficiency.

    • Digital AI Cores

      Digital AI cores are new accelerators for existing semiconductor technologies that use reduced precision to speed computation and decrease power consumption.

    • Heterogeneous Integration

      AI applications drive the need for a system level optimization of AI Hardware through Heterogeneous Integration of Accelerators, Memory and CPU. The AI Hardware center will focus on interconnect solutions to enable high speed, high bandwidth connectivity between the different components.

    • AI technology testbed

      The IBM Research AI Hardware Center will host research and development, prototyping, testing, and simulation activities for new AI cores specially designed for training and deploying advanced AI models, including a testbed in which members can demonstrate Center innovations in real-world applications. The testbed is a customizable platform for testing the accuracy and efficiency of new AI technologies for training and inferencing on image, speech, and text workloads. 

    Our work

    Tools + Code

    Leadership

    JB
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    Jeffrey Burns
    Director, AI Compute
    LC
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    Leland Chang
    Principal RSM and Senior Manager, AI Hardware Design
    KM
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    Kaoutar El Maghraoui
    Principal Research Staff Member, AI Engineering, IBM Research AI
    VN
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    Vijay Narayanan
    IBM Fellow & Strategist, Physics of AI. Senior Manager, PCM and AI Materials
    MF
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    Mukta Farooq
    Distinguished RSM
    DM
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    Dale McHerron
    Senior Manager, Heterogeneous Integration & Process Strategy
    JR
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    John Rozen
    Program Director, AI Hardware Center. Manager, Resistive Memories
    AS
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    Abu Sebastian
    Distinguished RSM & Manager, In-memory computing
    GB
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    Geoffrey Burr
    Distinguished RSM
    KH
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    Kohji Hosokawa
    Science & Technology

    Contact us for additional information on how to join the AI Hardware Center.

    Contact us
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    Explore our 
AI Hardware Research

    IBM Research is developing new devices and hardware architectures that support the tremendous processing power and unprecedented speed that AI requires to realize its full potential.