Lithography, in the context of building integrated circuits such as DRAMs and microprocessors, is a highly specialized printing process used to put detailed patterns onto silicon wafers. An image containing the desired pattern is projected onto the wafer, which is coated by a thin layer of photosensitive material called "resist". The bright parts of the image pattern cause chemical reactions which cause the resist material to become soluble, and thus dissolve away in a developer liquid, whereas the dark portions of the image remain insoluble. After development, the resist forms a stenciled pattern across the wafer surface which accurately matches the desired pattern. Finally, the pattern is permanently transferred into the wafer surface, for example by a chemical etchant which etches everywhere that is not protected by resist. ( Hence the term resist for the material which "resists" the etch.)
The basic lithographic process is similar to the photolithographic process used to make plates for offset printing presses. However, building state-of-the-art chips places unusual demands on the lithographic process, including:
Many types of lithographic processes, with different exposure energy, have been explored for building advanced chips. Optical lithography, where the exposure energy is visible or UltraViolet light, is the most important technique for volume manufacturing. For many years, IBM has been a leader in the drive to reduce the wavelength of light in order to print smaller features. Exposure wavelengths have gone from blue (436nm) to UltraViolet (365nm) to Deep UltraViolet(248nm), and will go to 193 nm over the next decade. IBM researchers have invented new resist processes for these shorter wavelengths, many of which depend on the idea of Chemically Amplified Resists, a powerful concept invented by researchers at IBM's Almaden Research Center. IBM has pioneered the use of step and scan lithographic exposure tools, phase shift mask techniques, anti-reflection coatings and many other innovations which are in use around the world.
A lithographer in an IBM clean room holds a patterned silicon wafer, containing roughly one hundred 64Megabit DRAM chips. The colorful patterns are caused by light diffracted by myriad tiny lines on the wafer.
IBM is a world leader in the area of X-ray lithography, where the exposure wavelength is reduced to roughly 1nm, a two hundred-fold reduction from Deep UltraViolet. At our Advanced Lithography Facility in Fishkill, NY, a compact synchrotron is used as a powerful, and reliable, source of X-rays.
This Scanning Electron Micrograph shows 130nm wide lines printed by X-ray lithography, a dimension several generations beyond those in production today. The steep sidewalls of this line are considered ideal for subsequent processing steps.