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The dual-core POWER6 microprocessor has double the speed of the previous-generation POWER5 microprocessor without increasing the energy required for its operation. It is currently the world’s fastest processor chip. The topics described in the nine papers in this issue include chip architecture, performance accelerators, chip and circuit design, power and heat management, enhanced virtualization, and reliability.
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IBM POWER6 Microprocessor Technology
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Preface
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H. Mehta, Guest Editor
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p. 637
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IBM POWER6 microarchitecture
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H. Q. Le, W. J. Starke, J. S. Fields, F. P. O’Connell, D. Q. Nguyen, B. J. Ronchetti, W. M. Sauer, E. M. Schwarz, and M. T. Vaden
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p. 639
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IBM POWER6 accelerators: VMX and DFU
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L. Eisen, J. W. Ward III, H.-W. Tast, N. Mäding, J. Leenstra, S. M. Mueller, C. Jacobi, J. Preiss, E. M. Schwarz, and S. R. Carlough
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p. 663
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IBM POWER6 microprocessor physical design and design methodology
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R. Berridge, R. M. Averill III, A. E. Barish, M. A. Bowen, P. J. Camporese, J. DiLullo, P. E. Dudley, J. Keinert, D. W. Lewis, R. D. Morel, T. Rosser, N. S. Schwartz, P. Shephard, H. H. Smith, D. Thomas, P. J. Restle, J. R. Ripley, S. L. Runyon, and P. M. Williams
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p. 685
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Power-constrained high-frequency circuits for the IBM POWER6 microprocessor
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B. Curran, E. Fluhr, J. Paredes, L. Sigal, J. Friedrich, Y.-H. Chan, and C. Hwang
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p. 715
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System power management support in the IBM POWER6 microprocessor
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M. S. Floyd, S. Ghiasi, T. W. Keller, K. Rajamani, F. L. Rawson, J. C. Rubio, and M. S. Ware
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p. 733
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IBM POWER6 SRAM arrays
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D. W. Plass and Y. H. Chan
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p. 747
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IBM POWER6 partition mobility: Moving virtual servers seamlessly between physical systems
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W. J. Armstrong, R. L. Arndt, T. R. Marchini, N. Nayar, and W. M. Sauer
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p. 757
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IBM POWER6 reliability
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M. J. Mack, W. M. Sauer, S. B. Swaney, and B. G. Mealey
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p. 763
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EnergyScale for IBM POWER6 microprocessor-based systems
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H.-Y. McCreary, M. A. Broyles, M. S. Floyd, A. J. Geissler, S. P. Hartman, F. L. Rawson, T. J. Rosedahl, J. C. Rubio, and M. S. Ware
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p. 775
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Author index for Volume 51
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p. 787
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Subject index for Volume 51
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p. 795
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