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Plasma processingVol. 43, No. 1/2, 1999
Order No. G322-0216 |
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This issue contains papers on the plasma etching and
deposition processes used in the fabrication of today's most
advanced integrated circuits and active-matrix displays.
Also covered is potential extendability to magnetic
recording head technology.
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Papers may be viewed by clicking on the title of interest |
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Preface
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by Y. Kuo, Guest Editor
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p. 3
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Plasma-assisted chemical vapor deposition
of dielectric thin films for ULSI semiconductor circuits
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D. R. Cote, S. V. Nguyen,
A. K. Stamper, D. S. Armbrust, D. Tobben, R. A. Conti, and G. Y. Lee
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p. 5
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Plasma-etching processes for ULSI semiconductor circuits
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M. Armacost, P. D. Hoh, R. Wise, W. Yan, J. J. Brown, J. H. Keller, G. A. Kaplita, S. D. Halle, K. P. Muller, M. D. Naeem, S. Srinivasan, H. Y. Ng, M. Gutsche, A. Gutmann, and B. Spuler
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p. 39
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Plasma processing in the fabrication of amorphous
silicon thin-film-transistor arrays
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Y. Kuo, M. Okajima, and M. Takeichi
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p. 73
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Fabrication of magnetic recording heads and dry etching of
head materials
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R. Hsiao
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p. 89
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Plasma processing damage in etching and deposition
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S. J. Fonash
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p. 103
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High-density plasma chemical vapor deposition of
silicon-based dielectric films for integrated circuits
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S. V. Nguyen
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p. 109
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Plasma-assisted oxidation, anodization, and nitridation of silicon
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D. W. Hess
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p. 127
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Plasma-deposited diamondlike carbon and related materials
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A. Grill
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p. 147
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Sputter deposition for semiconductor manufacturing
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S. M. Rossnagel
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p. 163
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Surface science issues in plasma etching
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G. S. Oehrlein, M. F. Doemling, B. E. E. Kastenmeier, P. J. Matsuo, N. R. Rueger, M. Schaepkens, and T. E. F. M. Standaert
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p. 181
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Modeling and simulation methods for plasma processing
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S. Hamaguchi
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p. 199
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Recent publications IBM authors
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p. 217
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Patents
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p. 227
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