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Electrochemical Microfabrication

Vol. 42, No. 5, 1998

Order No. G322-0214
This issue contains twelve papers on electrochemical microfabrication: an introductory overview, nine papers on microelectronic devices and packaging, one on magnetic recording devices, and one on microelectromechanical systems
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Table of contents HTML 
Papers may be viewed by clicking on the title of interest
Applications of electrochemical microfabrication: An introduction M. Datta Guest Editor p. 563
Microelectronic devices and packaging
Damascene copper electroplating for chip interconnections P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni p. 567
Electrochemical process for advanced package fabrication S. Krongelb, L. T. Romankiw, and J. A. Tornello p. 575
Metallization by plating for high-performance multichip modules K. K. H. Wong, S. Kaja, and P. W. DeHaven p. 587
Thin-film multichip module packages for high-end IBM servers E. D. Perfecto, A. P. Giri, R. R. Shields, H. P. Longworth, J. R. Pennacchia, and M. P. Jeanneret p. 597
Electrolessly deposited diffusion barriers for microelectronics E. J. O'Sullivan, A. G. Schrott, M. Paunovic, C. J. Sambucetti, J. R. Marino, P. J. Bailey, S. Kaja, and K. W. Semkow p. 607
Polarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders J. Horkans p. 621
Photoelectrochemical etching of semiconductors P. A. Kohl p. 629
Electrochemical microfabrication by laser-enhanced photothermal processes R. J. von Gutfeld and K. G. Sheppard p. 639
Microfabrication by electrochemical metal removal M. Datta p. 655
Magnetic recording devices
Future directions in electroplated materials for thin-film recording heads P. C. Andricacos and N. Robertson p. 671
Microelectromechanical systems
Integrated, variable-reluctance magnetic minimotor E. J. O'Sullivan, E. I. Cooper, L. T. Romankiw, K. T. Kwietniak, P. L. Trouilloud, J. Horkans, C. V. Jahnes, I. V. Babich, S. Krongelb, S. G. Hegde, J. A. Tornello, N. C. LaBianca, J. M. Cotte, and T. J. Chainer p. 681
Recent publications by IBM authors p. 695
Patents p. 711