IBM Skip to main content
  Home     Products & services     Support & downloads     My account  
  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Recent publications  
    Author's Guide  
  Contact Us
Finish Shopping  

On-chip interconnection technology

Vol. 39, No. 4, 1995

Order No. G322-0198
Rapid advances in silicon chip technology have resulted from progress made in both the "front end" of the chip manufacturing line, where circuit elements are fabricated, and the "back-end-of-line", where the elements are wired into integrated circuits. The relentless drive toward increased circuit count and device speed has necessitated both revolutionary and evolutionary changes in back-end-of-line manufacturing technology. The papers in this issue of the IBM Journal of Research and Development cover many innovations that have become part of IBM's manufacturing technology and several that will potentially contribute to this technology in the future.
Cover Picture
      click to enlarge  
Please note: All papers are available in PDF format. A feature paper and abstracts are available in HTML.
Table of contents
Papers may be viewed by clicking on the title of interest
Preface T. S. Kuan p. 370
Feature paper The evolution of interconnection technology at IBM J. G. Ryan, R. M. Geffken, N. R. Poulin, and J. R. Paraszczak p. 371
VLSI on-chip interconnection performance simulations and measurements D. C. Edelstein, G. A. Sai-Halasz, and Y.-J. Mii p. 383
Silicides and local interconnections for high-performance VLSI applications R. W. Mann, L. A. Clevenger, P. D. Agnello, and F. R. White p. 403
Interconnect fabrication processes and the development of low-cost wiring for CMOS products T. J. Licata, E. G. Colgan, J. M. E. Harper, and S. E. Luce p. 419
Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM D. R. Cote, S. V. Nguyen, W. J. Cote, S. L. Pennington, A. K. Stamper, and D. V. Podlesnik p. 437
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines C.-K. Hu, K. P. Rodbell, T. D. Sullivan, K. Y. Lee, and D. P. Bouldin p. 465
Recent publications by IBM authors p. 499
Recent IBM patents p. 513