Hubert Harrer IBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (hharrerde.ibm.com). Dr. Harrer is a Senior Technical Staff Member working in the IBM Systems and Technology Group. He received his Dipl.-Ing. degree in 1989 and his Ph.D. degree in 1992 from the Technical University of Munich. In 1993 he received a DFG research grant to work at the University of California at Berkeley. Since 1994 he has worked for IBM in the Boeblingen Packaging Department. In 1999 he was on International assignment at IBM Poughkeepsie, New York. Dr. Harrer's interests currently focus on System z first- and second-level packaging design for the IBM Systems and Technology Group. He has published multiple papers and holds six patents in the area of first-level and second-level packaging.

Daniel M. Dreps IBM Systems and Technology Group, 11400 Burnet Road, Austin, Texas 78758 (drepsdmus.ibm.com). Mr. Dreps is a Distinguished Engineer working in the IBM Systems and Technology Group. He received his B.S.E.E. degree in 1983 from Michigan State University. During his IBM career, he has designed and developed transistor models, fiber optic links, ASIC technology custom elements, and high-speed serial links for IBM servers. His interests currently focus on high-speed serial development and applications in the entire range of IBM servers. He has published multiple papers and holds more than 30 patents in broad areas of interconnect and server design.

Thomas-Michael Winkel IBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (winkelde.ibm.com). Dr. Winkel received his Diploma in electrical engineering in 1989 and his Ph.D. degree in 1997 from the University of Hannover, Germany. His research activities covered the area of characterization and modeling of on-chip interconnects using high-frequency measurements. In 1996 he joined IBM Development in Boeblingen, Germany. He is currently an Advisory Engineer in the IBM Systems and Technology Group, leading the electrical design team for second-level packaging in Boeblingen. Dr. Winkel's current focus is on electrical packaging design with respect to high-frequency signal distribution, power integrity, and system aspects for the pSeries* and zSeries. He is also interested in high-frequency on and off-chip measurements and the modeling of signal as well as power and ground lines. In this area he has led several internal and external high-frequency measurement projects up to 65 GHz. Dr. Winkel has authored or coauthored more than 20 conference and journal papers; he holds eight patents. He is program chair of the 2007 IEEE European Packaging Workshop and a member of the technical program committee of the workshop on Signal Propagation on Interconnects (SPI).

Wolfgang Scholz IBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (scholzwde.ibm.com). Mr. Scholz is an Advisory Engineer working in the IBM Systems and Technology Group. He graduated with a B.S. degree in telecommunications in 1979 at the GHS Paderborn and joined IBM at the Boeblingen laboratory in 1984. He has held various technical positions in S/390* processor power and packaging design in Boeblingen and Poughkeepsie. Returning from Poughkeepsie to Boeblingen in 2000, Mr. Scholz joined the Boeblingen processor card and board design team. In 2002 he certified as a Project Management Professional at the PMI. In 2003 he became card project manager, leading the overall packaging project for the z9 processor cage design.

Bao G. Truong IBM Systems and Technology Group, 11400 Burnet Road, Austin, Texas 78758 (baous.ibm.com). Mr. Truong received a B.S. degree in electrical engineering from the University of Texas at Austin in 1999. Since 1998, he has been a member of the IBM Systems and Technology Group in Austin, Texas, working in high-speed link design. His areas of specialty include interconnect analysis, circuit design, and design optimization for the IBM pSeries and zSeries platforms. He currently works on SRAM design and power optimization.

Andreas Huber IBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (huberade.ibm.com). Dr. Huber is an Advisory Engineer working in the IBM Systems and Technology Group. He received his Dipl.-Ing. degree in 1996 and his Ph.D. degree in 2001 from the Technical University of Karlsruhe, Germany. Since 1999 he has worked in the Packaging Department at the IBM Boeblingen Development Laboratory, working on first- and second-level packaging. From 2003 to 2006 he was on international assignment at IBM Austin, Texas. Dr. Huber's field of interest is power distribution and power integrity. He has published a number of papers and has reached the third patent application plateau.

Tingdong Zhou IBM Systems and Technology Group, 11400 Burnet Road, Austin, Texas 78758 (tingdongus.ibm.com). Dr. Zhou received the B.S. and M.S. degrees in electrical engineering from Tsinghua University, Beijing, China, in 1992 and 1995, and the Ph.D. degree in electrical engineering from the University of Arizona at Tucson in 2002. Since 2002, he has been with the IBM Systems and Technology Group, working on the electrical design of the components that comprise a high-frequency CMOS processor system. His current interests focus on electromagnetic modeling of high-speed circuits, electrical modeling and simulation of high-speed and high-performance packages, and signal integrity issues in the design of server systems. Dr. Zhou has published more than twenty conference and journal papers.

Kenneth L. Christian IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (kenchrisus.ibm.com). Mr. Christian received a B.S. degree from Southern Illinois University. He is an Advisory Engineer in the I/O and Package Development Department at the IBM Poughkeepsie Development Laboratory. He joined IBM in 1984 and has worked on package signal integrity and timing across module, card, and boards. Mr. Christian holds three patents; he received an IBM Outstanding Technical Achievement Award in 1999 for development of the NetRules tool for system and package design.

Gary F. Goth IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (gfgothus.ibm.com). Mr. Goth received his B.S.E. degree from Princeton University in 1971, his M.S. degree in mechanical engineering from Union College in 1975, and his M.S. degree in statistics in 1978 from Rensselaer Polytechnic Institute. Since joining IBM in 1979, he has held managerial and technical positions in server group development. Currently a Senior Technical Staff Member, Mr. Goth is responsible for high-end server cooling. He holds 29 patents in thermal technologies, with nine patents pending. He has coauthored several technical publications and has received IBM Outstanding Innovation and Outstanding Technical Achievement Awards in thermal technology.

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