Subject index for papers in Volume 49

Subject		Author	Page
Adhesion science
	Effects of mechanical stress and moisture on packaging interfaces	Buchwalter	663
Algorithms
	Exploring the limits of prefetching	Emma	127
Alloys
	Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications	Kang	607
	Recent developments in high-moment electroplated materials for recording heads	Cooper	103
Analytical models
	BladeCenter thermal diagnostics	Piazza	977
Arithmetic and logical unit design
	Design and exploitation of a high-performance SIMD floating-point unit for Blue Gene/L	Chatterjee	377
	IBM PowerPC 440 FPU with complex-arithmetic extensions	Wait	249
	Vectorization techniques for the Blue Gene/L double FPU	Lorenz	437
ASICs
	Blue Gene/L compute chip: Synthesis, timing, and physical design	Bright	277
Biology and biomedical studies
	Overview of molecular dynamics techniques and early scientific results from the Blue Gene project	Suits	475
Circuit and device technology
	Design and exploitation of a high-performance SIMD floating-point unit for Blue Gene/L	Chatterjee	377
Clocking
	Blue Gene/L compute chip: Synthesis, timing, and physical design	Bright	277
CMOS
	Embedded DRAM: Technology platform for the Blue Gene/L chip	Iyer	333
Communications and communication networks
	Design and implementation of message-passing services for the Blue Gene/L supercomputer	Almási	393
Computation
	Exploring the limits of prefetching	Emma	127
	Organization and implementation of the register-renaming mapper for out-of-order IBM POWER4 processors	Buti	167
Computer applications
	BladeCenter solutions	Fore	861
	BladeCenter systems management software	Pruett	963
Computer architecture
	BladeCenter chassis management	Brey	941
	BladeCenter midplane and media interface card	Hughes	823
	BladeCenter processor blades, I/O expansion adapters, and units	Hughes	837
	BladeCenter system overview	Desai	809
	Overview of the Blue Gene/L system architecture	Gara	195
Computer organization and design
	Organization and implementation of the register-renaming mapper for out-of-order IBM POWER4 processors	Buti	167
Controlled-collapse chip connection (C-4) technology
	Low-cost wafer bumping	Gruber	621
Cooling
	BladeCenter packaging, power, and cooling	Crippen	887
	Challenges of data center thermal management	Schmidt	709
	Mixing, rheology, and stability of highly filled thermal pastes	Feger	699
	Packaging the Blue Gene/L supercomputer	Coteus	213
Copper
	Electrochemical planarization of interconnect metallization	West	37
	Multiscale simulations of copper electrodeposition onto a resistive substrate	Drews	49
	Superconformal film growth: Mechanism and quantification	Moffat	19
	The chemistry of additives in damascene copper plating	Vereecken	3
Damascene process
	The chemistry of additives in damascene copper plating	Vereecken	3
Design verification
	Blue Gene/L advanced diagnostics environment	Giampapa	319
	Functional formal verification on designs of pSeries microprocessors and communication subsystems	Gott	565
	Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systems	Victor	541
	Using microcode in the functional verification of an I/O chip	Goldman	581
Device design
	Introduction to the Cell multiprocessor	Kahle	589
	Organization and implementation of the register-renaming mapper for out-of-order IBM POWER4 processors	Buti	167
Electrochemistry
	Design and modeling of equipment used in electrochemical processes for microelectronics	Ritzdorf	65
	Electrochemical planarization of interconnect metallization	West	37
Electrodeposition
	Multiscale simulations of copper electrodeposition onto a resistive substrate	Drews	49
	Recent developments in high-moment electroplated materials for recording heads	Cooper	103
	Superconformal film growth: Mechanism and quantification	Moffat	19
	Tuning the properties of magnetic nanowires	Sun	79
Electroless plating
	Design and modeling of equipment used in electrochemical processes for microelectronics	Ritzdorf	65
Etching
	Design and modeling of equipment used in electrochemical processes for microelectronics	Ritzdorf	65
Fluids and fluid dynamics
	Challenges of data center thermal management	Schmidt	709
Fourier transforms
	Scalable framework for 3D FFTs on the Blue Gene/L supercomputer: Implementation and early performance measurements	Eleftheriou	457
	Vectorization techniques for the Blue Gene/L double FPU	Lorenz	437
IBM POWER5 system
	Advanced virtualization capabilities of POWER5 systems	Armstrong	523
	Characterization of simultaneous multithreading (SMT) efficiency in POWER5	Mathis	555
	Functional formal verification on designs of pSeries microprocessors and communication subsystems	Gott	565
	Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systems	Victor	541
	Operating system exploitation of the POWER5 system	Mackerras	533
	POWER5 system microarchitecture	Sinharoy	505
Information technology
	BladeCenter systems management software	Pruett	963
Integrated circuit design
	Logic-based eDRAM: Origins and rationale for use	Matick	145
	Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements	Lanzerotti	777
Interconnection technology
	Blue Gene/L torus interconnection network	Adiga	265
	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection	Knickerbocker	725
	Exploitation of optical interconnects in future server architectures	Benner	755
	Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects	Yarmchuk	677
	Low-cost wafer bumping	Gruber	621
	Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications	Kang	607
	The chemistry of additives in damascene copper plating	Vereecken	3
Interfaces
	Design and implementation of message-passing services for the Blue Gene/L supercomputer	Almási	393
	Effects of mechanical stress and moisture on packaging interfaces	Buchwalter	663
	Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications	Kang	607
	Mixing, rheology, and stability of highly filled thermal pastes	Feger	699
Lead
	Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications	Kang	607
Magnetics—studies and structures
	Recent developments in high-moment electroplated materials for recording heads	Cooper	103
	Tuning the properties of magnetic nanowires	Sun	79
Manufacturing
	Design and modeling of equipment used in electrochemical processes for microelectronics	Ritzdorf	65
	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection	Knickerbocker	725
	Low-cost wafer bumping	Gruber	621
Markov process analysis
	Optimizing task layout on the Blue Gene/L supercomputer	Bhanot	489
Materials
	Mixing, rheology, and stability of highly filled thermal pastes	Feger	699
Materials technology
	Mixing, rheology, and stability of highly filled thermal pastes	Feger	699
	Recent developments in high-moment electroplated materials for recording heads	Cooper	103
	The evolution of build-up package technology and its design challenges	Blackshear	641
Mathematical functions and techniques
	Custom math functions for molecular dynamics	Enenkel	465
	Vectorization techniques for the Blue Gene/L double FPU	Lorenz	437
Memory (computer) design and technology
	Blue Gene/L compute chip: Memory and Ethernet subsystem	Ohmacht	255
	Embedded DRAM: Technology platform for the Blue Gene/L chip	Iyer	333
Memory, cache
	Logic-based eDRAM: Origins and rationale for use	Matick	145
Metallurgy
	Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications	Kang	607
Microprocessor systems and applications
	Introduction to the Cell multiprocessor	Kahle	589
	POWER5 system microarchitecture	Sinharoy	505
Models and modeling
	BladeCenter thermal diagnostics	Piazza	977
	Electrochemical planarization of interconnect metallization	West	37
	Superconformal film growth: Mechanism and quantification	Moffat	19
Monte Carlo methods
	Multiscale simulations of copper electrodeposition onto a resistive substrate	Drews	49
	Optimizing task layout on the Blue Gene/L supercomputer	Bhanot	489
Multichip modules (MCMs)
	High-speed electrical testing of multichip ceramic modules	Manzer	687
Multilayers
	The evolution of build-up package technology and its design challenges	Blackshear	641
Multiprocessors
	Introduction to the Cell multiprocessor	Kahle	589
Nanoscale structures and devices
	Tuning the properties of magnetic nanowires	Sun	79
Networks
	BladeCenter networking	Hunter	905
	BladeCenter storage	Holland	921
	BladeCenter T system for the telecommunications industry	Vanderlinden	873
	Blue Gene/L torus interconnection network	Adiga	265
Operating systems
	Advanced virtualization capabilities of POWER5 systems	Armstrong	523
	Blue Gene/L programming and operating environment	Moreira	367
	Operating system exploitation of the POWER5 system	Mackerras	533
Optical interconnections
	Exploitation of optical interconnects in future server architectures	Benner	755
Packaging
	BladeCenter packaging, power, and cooling	Crippen	887
	Challenges of data center thermal management	Schmidt	709
	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection	Knickerbocker	725
	Effects of mechanical stress and moisture on packaging interfaces	Buchwalter	663
	Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements	Lanzerotti	777
	Mixing, rheology, and stability of highly filled thermal pastes	Feger	699
	Packaging the Blue Gene/L supercomputer	Coteus	213
	The evolution of build-up package technology and its design challenges	Blackshear	641
Parallel processing
	Blue Gene/L compute chip: Memory and Ethernet subsystem	Ohmacht	255
	Blue Gene/L performance tools	Martorell	407
	Blue Gene/L programming and operating environment	Moreira	367
	Custom math functions for molecular dynamics	Enenkel	465
	Design and exploitation of a high-performance SIMD floating-point unit for Blue Gene/L	Chatterjee	377
	Early performance data on the Blue Matter molecular simulation framework	Germain	447
	IBM PowerPC 440 FPU with complex-arithmetic extensions	Wait	249
	Optimizing task layout on the Blue Gene/L supercomputer	Bhanot	489
	Overview of molecular dynamics techniques and early scientific results from the Blue Gene project	Suits	475
	Overview of the Blue Gene/L system architecture	Gara	195
	Overview of the QCDSP and QCDOC computers	Boyle	351
	Packaging the Blue Gene/L supercomputer	Coteus	213
	Resource allocation and utilization in the Blue Gene/L supercomputer	Aridor	425
	Scalable framework for 3D FFTs on the Blue Gene/L supercomputer: Implementation and early performance measurements	Eleftheriou	457
	Vectorization techniques for the Blue Gene/L double FPU	Lorenz	437
Performance analysis
	Blue Gene/L compute chip: Control, test, and bring-up infrastructure	Haring	289
	Blue Gene/L performance tools	Martorell	407
	Characterization of simultaneous multithreading (SMT) efficiency in POWER5	Mathis	555
	Early performance data on the Blue Matter molecular simulation framework	Germain	447
	Exploring the limits of prefetching	Emma	127
	Resource allocation and utilization in the Blue Gene/L supercomputer	Aridor	425
Power management
	BladeCenter packaging, power, and cooling	Crippen	887
	BladeCenter processor blades, I/O expansion adapters, and units	Hughes	837
	Packaging the Blue Gene/L supercomputer	Coteus	213
	POWER5 system microarchitecture	Sinharoy	505
Process control and development
	The evolution of build-up package technology and its design challenges	Blackshear	641
Programming, programs, and programming languages
	Blue Gene/L programming and operating environment	Moreira	367
Protein folding
	Custom math functions for molecular dynamics	Enenkel	465
	Overview of molecular dynamics techniques and early scientific results from the Blue Gene project	Suits	475
Quantum theory and effects
	Overview of the QCDSP and QCDOC computers	Boyle	351
Reliability
	High-speed electrical testing of multichip ceramic modules	Manzer	687
	Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects	Yarmchuk	677
Robotics
	High-speed electrical testing of multichip ceramic modules	Manzer	687
Servers
	BladeCenter chassis management	Brey	941
	BladeCenter midplane and media interface card	Hughes	823
	BladeCenter networking	Hunter	905
	BladeCenter processor blades, I/O expansion adapters, and units	Hughes	837
	BladeCenter solutions	Fore	861
	BladeCenter storage	Holland	921
	BladeCenter system overview	Desai	809
	BladeCenter systems management software	Pruett	963
	BladeCenter T system for the telecommunications industry	Vanderlinden	873
	BladeCenter thermal diagnostics	Piazza	977
	Exploitation of optical interconnects in future server architectures	Benner	755
Silicon
	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection	Knickerbocker	725
Simulation
	Early performance data on the Blue Matter molecular simulation framework	Germain	447
	Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systems	Victor	541
	Overview of molecular dynamics techniques and early scientific results from the Blue Gene project	Suits	475
Simultaneous multithreading (SMT)
	Characterization of simultaneous multithreading (SMT) efficiency in POWER5	Mathis	555
	Operating system exploitation of the POWER5 system	Mackerras	533
	POWER5 system microarchitecture	Sinharoy	505
Solder ball connect (SBC) technology
	Low-cost wafer bumping	Gruber	621
Storage (computer) devices and systems
	BladeCenter storage	Holland	921
Storage hierarchies
	Logic-based eDRAM: Origins and rationale for use	Matick	145
Supercomputing
	Blue Gene/L compute chip: Memory and Ethernet subsystem	Ohmacht	255
	Blue Gene/L performance tools	Martorell	407
	Blue Gene/L programming and operating environment	Moreira	367
	Custom math functions for molecular dynamics	Enenkel	465
	Design and exploitation of a high-performance SIMD floating-point unit for Blue Gene/L	Chatterjee	377
	Early performance data on the Blue Matter molecular simulation framework	Germain	447
	IBM PowerPC 440 FPU with complex-arithmetic extensions	Wait	249
	Overview of molecular dynamics techniques and early scientific results from the Blue Gene project	Suits	475
	Overview of the Blue Gene/L system architecture	Gara	195
	Packaging the Blue Gene/L supercomputer	Coteus	213
	Scalable framework for 3D FFTs on the Blue Gene/L supercomputer: Implementation and early performance measurements	Eleftheriou	457
Surface effects
	Effects of mechanical stress and moisture on packaging interfaces	Buchwalter	663
System-on-a-chip (SoC)
	Blue Gene/L compute chip: Memory and Ethernet subsystem	Ohmacht	255
	Design and exploitation of a high-performance SIMD floating-point unit for Blue Gene/L	Chatterjee	377
	Embedded DRAM: Technology platform for the Blue Gene/L chip	Iyer	333
	Verification strategy for the Blue Gene/L chip	Wazlowski	303
Telephony
	BladeCenter T system for the telecommunications industry	Vanderlinden	873
Testing
	Blue Gene/L advanced diagnostics environment	Giampapa	319
	Characterization of simultaneous multithreading (SMT) efficiency in POWER5	Mathis	555
	Functional formal verification on designs of pSeries microprocessors and communication subsystems	Gott	565
	Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects	Yarmchuk	677
	Using microcode in the functional verification of an I/O chip	Goldman	581
Testing, chip
	Blue Gene/L compute chip: Control, test, and bring-up infrastructure	Haring	289
	High-speed electrical testing of multichip ceramic modules	Manzer	687
Verification
	Functional formal verification on designs of pSeries microprocessors and communication subsystems	Gott	565
	Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systems	Victor	541
	Using microcode in the functional verification of an I/O chip	Goldman	581
	Verification strategy for the Blue Gene/L chip	Wazlowski	303
Virtual machines
	Advanced virtualization capabilities of POWER5 systems	Armstrong	523
VLSI
	Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements	Lanzerotti	777