Thomas-Michael WinkelIBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (winkel@de.ibm.com). Dr. Winkel received his Diploma in electrical engineering in 1989 and his Ph.D. degree in 1997 from the University of Hannover, Germany. His research activities covered the area of characterization and modeling of on-chip interconnects using high-frequency measurements. In 1996 he joined the IBM development laboratory in Boeblingen, Germany. He is currently an Advisory Engineer in the IBM Server Group in Boeblingen, leading the electrical design team for second-level packaging. Dr. Winkel's current focus is electrical packaging design with respect to high-frequency signal distribution, power noise, and system aspects for the pSeries and zSeries. He is also interested in high-frequency on- and off-chip measurements and modeling of signal as well as power and ground lines. He has published multiple papers and holds four patents.
Wiren D. (Dale) BeckerIBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (wbecker@us.ibm.com). Dr. Becker received his Ph.D. degree from the University of Illinois. He is currently a Senior Technical Staff Member in the IBM Systems and Technology Group, leading the package design team that integrates and implements the multiprocessor design for IBM's large server platforms. Dr. Becker's current interests focus on robust electrical design methodologies for a high-frequency CMOS processor system. He specializes in the application of electromagnetic numerical methods to the issues of signal integrity and simultaneous switching noise in electronic packaging, the measurement of these phenomena, and the verification of the models. He has published four papers in the IBM Journal of Research and Development, as well as more than 50 conference and journal papers. Dr. Becker has reached the second invention plateau at IBM.
Hubert HarrerIBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (hharrer@de.ibm.com). Dr. Harrer is a Senior Technical Staff Member working in the IBM Server Group. He received his Dipl.-Ing. degree in 1989 and his Ph.D. degree in 1992 from the Technical University of Munich. In 1993 he received a DFG research grant to work at the University of California at Berkeley. Since 1994 he has worked for IBM in the Boeblingen Packaging Department. In 1999 he was on international assignment at IBM Poughkeepsie, New York. Dr. Harrer's interests currently focus on zSeries first- and second-level packaging design for the IBM Server Division. He has published multiple papers and holds six patents in the area of first-level and second- level packaging.
Harald ProssIBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (hpross@de.ibm.com). Mr. Pross is an Advisory Engineer working in the IBM Server Group. After joining IBM in 1975, he studied applied physics at the Fachhochschule Heilbronn from 1979 to 1984, graduating with a B.S. degree in physics in 1984 and joining the IBM Boeblingen laboratory that same year. He held various technical positions in S/390 processor packaging design in Boeblingen. In 1993 he moved to Rochester, Minnesota, to lead the card/board packaging design of the new high-end AS/400 multiprocessor system. Returning to Boeblingen in 1994, he worked on various printed wiring board designs for S/390 processors. In 1997 Mr. Pross became the project leader for the Boeblingen processor card and board designs. He led the development of the zSeries 900 processor cage in 2000 and has worked on packaging for the zSeries 990 processor. He is currently responsible for packaging implementation of the future high-performance, high-availability pSeries processor card and board development.
Dierk KallerIBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (dkaller@de.ibm.com). Mr. Kaller is an Advisory Engineer working in the IBM Server Group. He received his Diploma in electrical engineering in 1995 from the University of Hannover, Germany, joining the IBM development laboratory in Boeblingen that same year. Since then he has worked on various S/390 packaging designs in packaging development. He is currently responsible for the signal integrity of the first- and second-level packaging of the zSeries and pSeries high-end server.
Bernd GarbenIBM Systems and Technology Group, IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (garbenb@de.ibm.com). Dr. Garben is an Advisory Engineer in the IBM Server Group. He received his Ph.D. degree in physics from the University of Goettingen, Germany, in 1972. He joined the IBM Boeblingen Laboratory in 1974 and was on assignment at IBM East Fishkill from 1982 to 1984. Dr. Garben has worked in the areas of physical materials analysis, bipolar and CMOS semiconductor technology development, CMOS microprocessor failure analysis, and packaging development; he holds seven patents in those areas. His current field of interest is simultaneous switching noise analysis in electronic packaging.
Bruce J. ChamberlinIBM Integrated Supply Chain Division, 1701 North Street, Endicott, New York 13760 (chamberb@us.ibm.com). Mr. Chamberlin is a Senior Engineer in the IBM Integrated Supply Chain Division. He holds a B.S. degree in mechanical engineering from Clarkson University. Mr. Chamberlin holds six patents, three of which are utilized in production zSeries machines. He has been the product engineer for Clark raw boards and for the Clark board assembly, and the program manager for development and qualification of high-end PWBs supporting zSeries machines. He currently works in the Electronic Materials/ Processes Department within Procurement, responsible for support of the high-end iSeries, pSeries, and zSeries circuit boards and assemblies.
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