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Volume 48, Number 3/4, 2004
IBM eServer z990 |
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Table of contents:
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This article:
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Packaging the IBM eServer z990 central electronic complex - References
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by
J. C. Parrilla, F. E. Bosco, J. S. Corbin, J. J. Loparco, P. Singh, and J. G. Torok
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References
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P. Singh, S. J. Ahladas, W. D. Becker, F. E. Bosco, J. P. Corrado, G. F. Goth, S. Iruvanti, M. A. Nobile, B. D. Notohardjono, J. H. Quick, E. J. Seminaro, K. M. Soohoo, and C. Wu, “A Power, Packaging, and Cooling Overview of the IBM eServer z900,” IBM J. Res. & Dev. 46, No. 6, 711–738 (November 2002).
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G. F. Goth, D. J. Kearney, U. Meyer, and D. W. Porter, “Hybrid Cooling with Cycle Steering in the IBM eServer z990,” IBM J. Res. & Dev. 48, No. 3/4, 425–439 (May/July 2004, this issue).
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J. U. Knickerbocker, F. L. Pompeo, A. F. Tai, D. L. Thomas, R. D. Weekly, M. G. Nealon, H. C. Hamel, A. Haridass, J. N. Humenik, S. N. Reddy, R. A. Shelleman, K. M. Prettyman, B. V. Fasano, S. K. Ray, T. E. Lombardi, K. C. Marston, P. A. Coico, P. J. Brofman, L. S. Goldmann, D. L. Edwards, J. A. Zitz, S. Iruvanti, S. L. Shinde, and H. P. Longworth, “An Advanced Multichip Module (MCM) for High-Performance UNIX Servers,” IBM J. Res. & Dev. 46, No. 6, 779–804 (November 2002).
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J. S. Corbin, C. N. Ramirez, and D. E. Massey, “Land Grid Array Sockets for Server Applications,” IBM J. Res. & Dev. 46, No. 6, 763–778 (November 2002).
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J. G. Torok, G. F. Goth, K. D. Waddell, and J. J. Loparco, “Compression Connector Actuation System,” U.S. Patent 6,845,311, November 26, 2002.
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Mark K. Hoffmeyer, John L. Colbert, John G. Torok, John S. Corbin, and William L. Brodsky, “System Packaging for Robust LGA Interconnect Technology in High Performance Computing Applications,” presented at the International Symposium on Microelectronics (IMAPS), Boston, November 16–20, 2003.
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J. G. Torok, B. D. Notohardjono, J. J. Loparco, W. P. Kostenko, and J. S. Corbin, “Method and Apparatus for Providing Positive Contact Force in an Electrical Assembly,” U.S. Patent Application POU920030012US1, May 12, 2003, patent pending.
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J. G. Torok, B. D. Notohardjono, G. F. Goth, J. A. Hickey, and J. J. Loparco, “Support Means for Isolating Thermal Device Mass Effects on LGA Interconnections,” IBM Tech. Disclosure Bull. (December 2002); published on IP.com June 20, 2003.
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L. C. Alves, M. L. Fair, P. J. Meaney, C. L. Chen, W. J. Clarke, G. C. Wellwood, N. E. Weber, I. N. Modi, B. K. Tolan, and F. Freier, “RAS Design for the IBM eServer z900,” IBM J. Res. & Dev. 46, No. 4/5, 503–521 (July/September 2002).
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T.-M. Winkel, W. D. Becker, H. Harrer, H. Pross, D. Kaller, B. Garben, B. J. Chamberlin, and S. A. Kuppinger, “First- and Second-Level Packaging of the z990 Processor Cage,” IBM J. Res. & Dev. 48, No. 3/4, 395–410 (May/July 2004, this issue).
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