Biographical sketches of authors

Juan C. Parrilla IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (parrilla@us.ibm.com). Mr. Parrilla is an Advisory Engineer in the Product, Power, Packaging, and Cooling Architecture and Business Management Department. He received a B.S. degree in mechanical engineering from the Massachusetts Institute of Technology in 1982. That same year he joined the IBM Systems Development Division in Endicott, New York, helping to design the 9309 monocoque frame which was used on S/390, AS/400, and RS/6000 products. Mr. Parrilla joined the Power, Packaging, and Cooling Group in Poughkeepsie, where he has served as project leader on various bipolar and CMOS zSeries products from the 9121 and 9672 to the z900. He currently serves as project leader on the zSeries z990 and pSeries 7039.

Frank E. Bosco IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12603 (bosco@us.ibm.com). Mr. Bosco received a B.S.E.E. degree from Manhattan College in 1964 and an M.S.E.E. degree from Syracuse University in 1975. In 1964 he joined the IBM Systems Development Division in Poughkeepsie, where he worked on the early development of monolithic integrated circuits. In 1973, he worked on a team which was attempting to implement a full wafer memory package; following this, he worked on circuit designs for the first implementations of cryptographic algorithms. He worked in power-supply development from 1974 to 1978. From 1979 to 1981, Mr. Bosco worked on the hardware and software algorithms for automating personal identity verification. He joined the memory area in Kingston in 1981 and managed the group which developed the first L4 storage subsystem. In 1985 he joined the Corporate Development staff, where he led a task force which resulted in the introduction of built-in self-test (BIST) into CMOS logic arrays. Mr. Bosco rejoined the Kingston power group in 1988; since 1993, he has been involved in the development of the power, packaging, and cooling subsystems for zSeries CMOS mainframes. He is now a power, packaging, and cooling subsystem architect for future pSeries and zSeries eServers.

John S. Corbin IBM Systems and Technology Group, 11400 Burnet Road, Austin, Texas 78759 (jcorbin@us.ibm.com). Mr. Corbin received his B.S. and M.S. degrees in mechanical engineering from the University of Texas at Austin in 1972 and 1974, respectively. He joined IBM in 1974 and spent ten years in printer development, working primarily in the area of motion control. This was followed by six years in the System Technology Division Packaging Laboratory in Austin, applying finite element techniques in the area of mechanical-packaging reliability. He is currently a Senior Engineer in the eServer Group in Austin, Texas, where he has spent ten years in AIX workstation and eServer mechanical packaging development. Mr. Corbin is a Registered Professional Engineer in the state of Texas.

John J. Loparco IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (loparco@us.ibm.com). Mr. Loparco is a Senior Designer Specialist in the High End Mechanical Design and Integration Department in the IBM eServer Group. He received his associate degree from Mohawk Valley Community College in 1981, joining IBM that same year. Since then, he has been involved in high-end large-system development. Mr. Loparco holds nine U.S. patents and has received an IBM Outstanding Technical Achievement Award for his mechanical development leadership role on the S/390 G5 product.

Prabjit Singh IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (pjsingh@us.ibm.com). Dr. Singh is a Senior Engineer in the Materials and Processes Engineering Department in the IBM eServer Group, Poughkeepsie, New York. He received the B.Tech. (Honors) degree in metallurgical engineering from the Indian Institute of Technology, Kharagpur; the M.S. degree in microelectronic manufacturing from the Rensselaer Polytechnic Institute, Troy, New York; and the M.S. and Ph.D. degrees in metallurgy from the Stevens Institute of Technology, Hoboken, New Jersey. He has received an IBM Outstanding Technical Achievement Award for his contributions to the first IBM multichip refrigeration unit, more than 15 patents, nine IBM Invention Achievement Plateau awards, and four IBM Publication Achievement Awards. He is a recipient of the 2003 IBM Poughkeepsie Master Inventor Award. Dr. Singh is an Adjunct Professor of Electrical Engineering at the State University of New York, New Paltz. He is a member of the industry advisory board of the Department of Electrical Engineering and Computer Science, University of Illinois, Chicago, and the past chairman of the Electronic Materials Division of the ASM International.

John G. Torok IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601 (jtorok@us.ibm.com). Mr. Torok is a Senior Engineer in the Product, Power, Packaging, and Cooling Development Group. He graduated from the State University of New York in 1985 with a B.S. degree in applied physics. He is currently pursuing an M.S. degree in mechanical engineering at the National Technological University. Prior to joining IBM, he worked for 17 years in a variety of engineering capacities for Hubbell, Inc., developing connectors and vibration-suppression devices for the power utility industry. Since joining IBM in 1998, he has provided packaging integration development leadership for the 2029 DWDM Fiber Saver, the ET4 Emulator product, and the z990 series eServer. Recently, he has worked on the development of a variety of mechanical actuation systems for the land grid array attachment of multichip modules. He holds four patents, has achieved the second IBM invention plateau, and has received an IEEE Standards Development Award. Mr. Torok is a member of ASME.