IBMSkip to main content
  Home     Products & services     Support & downloads     My account  
  Select a country 
Journals Home 
 Systems Journal 
Journal of Research
and Development
 ·  Current Issue 
 ·  Recent Issues 
 ·  Papers in Progress 
 ·  Search/Index 
 ·  Orders 
 ·  Description 
 ·  Patents 
 ·  Recent publications 
 ·  Author's Guide 
 Staff 
 Contact Us 
 Related link: 
    IBM Research:
   Mathematical
   Sciences
 
IBM Journal of Research and Development 
Volume 47, Number 1, 2003
Mathematical Sciences at 40
 Table of contents: arrowHTML arrowPDF   This article: arrowHTML arrowPDF arrowCopyright info
  

Estimating the efficiency of collaborative problem-solving, with applications to chip design - Author Bios

by M. Y. L. Wisniewski, E. Yashchin, R. L. Franch, D. P. Conrady, G. Fiorenza, and I. C. Noyan

Biographical sketches of authors

Mary Y. L. Wisniewski IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598 (myl@us.ibm.com). Dr. Wisniewski received an A.B. degree summa cum laude from Harvard–Radcliffe Colleges, an M.Phil. degree from Cambridge University, and a Ph.D. degree in 1997 from Cornell University, all in physics. In 1996, she joined IBM as a Research Staff Member at the Thomas J. Watson Research Center, Yorktown Heights, New York. She is a member of the VLSI Design Department and was the integrator of the instruction fetch unit of the IBM POWER4 microprocessor. She is currently working on issues in CMOS VLSI design. Dr. Wisniewski is a member of the Institute of Electrical and Electronics Engineers (IEEE), IEEE-Lasers and Electro-Optics Society (LEOS), American Physical Society, Materials Research Society, and Optical Society of America. She was recently elected to the IEEE-LEOS Board of Governors.

Emmanuel Yashchin IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598 (yashchi@us.ibm.com). Dr. Yashchin received a Diploma in applied mathematics from Vilnius State University (U.S.S.R.) in 1974 and an M.Sc. degree in operations research and a D.Sc. degree in statistics from the Technion–Israel Institute of Technology in 1977 and 1981, respectively. In 1982 he was a Visiting Assistant Professor at Iowa State University. He joined IBM in 1983 as a Research Staff Member in the Statistics group of the Mathematical Sciences Department at the IBM Thomas J. Watson Research Center, Yorktown Heights, New York. Dr. Yashchin's research interests include change point models, quality control, reliability, and spatial statistics. He is a member of the American Statistical Association, Institute of Mathematical Statistics, Royal Statistical Society, and American Society for Quality.

Robert L. Franch IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598 (franch@us.ibm.com). Mr. Franch received the B.S.E.E. degree from the Polytechnic Institute of New York, Brooklyn, in 1980. That same year he joined IBM in East Fishkill, New York, where he worked on bipolar device reliability and stress testing of VLSI devices and interconnects. In 1984 he joined the IBM Research Division at the Thomas J. Watson Research Center as a member of the Test Systems group, where he worked on high-speed functional testing of n-MOS and CMOS chips developed at IBM Research. In 1993 he joined the VLSI Design group, where he has worked on circuit design for microprocessors. Mr. Franch has since been engaged in the design of CMOS circuit macros and has contributed to several generations of IBM S/390 microprocessors.

David P. Conrady Sequence Design Inc., 112 Avenue Kleber, 75016 Paris, France (dconrady@sequencedesign.com). Mr. Conrady received the B.A. degree from Rice University in computer science and French in 1985. That same year he joined IBM in East Fishkill, New York, where he developed automatic placement software for bipolar and CMOS VLSI designs. In 1993 he was the integrator of a chip in the RS/6000 microprocessor family in Austin, Texas. He was subsequently engaged in layout and timing optimization of several generations of IBM S/390 microprocessors at IBM in Boeblingen, Germany, and Poughkeepsie, New York. For the work reported in this paper, Mr. Conrady worked at IBM in the Microelectronics Division in Hopewell Junction, New York. In 2001 he joined Sequence Design Inc., where he supports timing and signal-integrity optimization of high-speed nanometer VLSI designs in Europe.

Giovanni Fiorenza IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598 (gfiorenz@us.ibm.com). Dr. Fiorenza received the B.S., M.S., and Ph.D. degrees in physics from Stevens Institute of Technology in 1979, 1984, and 1992, respectively. He joined the U.S. Air Force in 1979 and worked at the Air Force Weapons Laboratory, Kirtland AFB, Albuquerque, New Mexico, on laser damage in thin films until 1981. He joined IBM Component Vendor Assurance, Poughkeepsie, New York, in 1984 and worked on technology assessment, functional reliability, and soft-error evaluations of n-MOS and CMOS technologies until 1988, when he moved to IBM East Fishkill, New York, where he worked on the development of high-performance bipolar/BiCMOS technologies until 1992, and on device design and development of device simulation software until 1996. In 1996, he joined the IBM Thomas J. Watson Research Center in Yorktown Heights, New York, where he worked on circuit and physical design for the POWER4 microprocessor. He is currently working on circuit and physical design for high-performance microprocessors. Dr. Fiorenza holds one patent and is a member of the IEEE and Computer Society.

I. Cevdet Noyan IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598 (noyan@us.ibm.com). Dr. Noyan is a Research Staff Member with the Thin Film Metallurgy group at the IBM Thomas J. Watson Research Center in Yorktown Heights, New York. He has been with IBM since 1985 and has worked on computer structures at the box, package, and chip levels. He is currently working on thin-film wiring issues.