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IBM Journal of Research and Development 
Volume 46, Number 6, 2002
System-on-a-Chip and Packaging
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A power, packaging, and cooling overview of the IBM eServer z900 - References
by P. Singh, S. J. Ahladas, W. D. Becker, F. E. Bosco, J. P. Corrado, G. F. Goth, S. Iruvanti, M. A. Nobile, B. D. Notohardjono, J. H. Quick, E. J. Seminaro, K. M. Soohoo, and C. Wu

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