Biographical sketches of authors

Prabjit Singh IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (pjsingh@us.ibm.com). Dr. Singh is a Senior Engineer in the Materials and Processes Engineering Department in the IBM Server Group. He received his B.Tech. degree (with honors) in metallurgical engineering from the Indian Institute of Technology, Kharagpur, his M.S. degree in microelectronics manufacturing from Rensselaer Polytechnic Institute, and his M.S. and Ph.D. degrees in metallurgy from the Stevens Institute of Technology. Dr. Singh received an IBM Outstanding Technical Achievement Award for his contributions to the first IBM multichip refrigeration unit. He holds more than ten patents and has received seven IBM Invention Achievement Plateau Awards and three IBM Publication Achievement Awards. He is a past chairman of the Electronic Materials Division of ASM International.

Steven J. Ahladas IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (ahladas@us.ibm.com). Mr. Ahladas is a Senior Engineer in the Product Power, Packaging, and Cooling Architecture Department in the IBM Server Group. He received his B.S. degree in electrical engineering from the University of Massachusetts at Amherst in 1984. He has received one IBM Outstanding Technical Achievement Award and has been granted four U.S. patents. Mr. Ahladas is a registered Professional Engineer in the state of New York.

Wiren D. (Dale) Becker IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (wbecker@us.ibm.com). Dr. Becker is a Senior Technical Staff Member in the IBM Server Group. He received his B.E.E. degree from the University of Minnesota at Minneapolis, his M.S.E.E. degree from Syracuse University, and his Ph.D. degree from the University of Illinois at Urbana–Champaign. He is currently a Senior Technical Staff Member leading the MCM design team that integrates and implements the multiprocessor design for IBM S/390 platforms. He has received IBM Outstanding Technical Achievement Awards for the design and development of G4, G6, and z900 MCM packaging and an IBM Outstanding Innovation Award for the G5 package development. He has authored or co-authored more than fifty journal articles and conference papers and has achieved the first invention plateau at IBM. Dr. Becker's current interests focus on the electrical design of the components that comprise a high-frequency CMOS processor system. He specializes in the application of electromagnetic numerical methods to the issues of signal integrity and simultaneous switching noise in electronic packaging, the measurement of these phenomena, and the verification of the models. Dr. Becker is a member of IEEE and IMAPS.

Frank E. Bosco IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (bosco@us.ibm.com). Mr. Bosco received a B.S.E.E. degree from Manhattan College in 1964 and an M.S.E.E. degree from Syracuse University in 1975. In 1964 he joined the IBM Systems Development Division in Poughkeepsie, where he worked on the early development of monolithic integrated circuits. In 1973, he worked on a team which was attempting to implement a full wafer memory package; he subsequently worked on circuit designs for the first implementations of cryptographic algorithms. Mr. Bosco worked in power-supply development from 1974 to 1978. From 1979 to 1981, he worked on the hardware and software algorithms for automating personal identity verification. He joined the memory area in Kingston in 1981 and managed the group which developed the first L4 storage subsystem. In 1985 he joined the Corporate Development staff, where he led a task force which resulted in the introduction of built-in self-test (BIST) into CMOS logic arrays. Mr. Bosco rejoined the Kingston power group in 1988; since 1993 he has been involved in the development of the power, packaging, and cooling subsystems for zSeries CMOS mainframes. He is now a power, packaging, and cooling subsystem architect for future pSeries and zSeries servers.

Joseph P. Corrado IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (jpcorrad@us.ibm.com). Mr. Corrado is an Advisory Engineer and Project Manager in the IBM Server Group. He received his master's degree in computer science from Union College in 1993 and his B.S. degree in aerospace space engineering from the State University of New York at Buffalo in 1985. He holds several U.S. patents and has extensive experience in DFMA, plastic part design, and optical instrument design. In 1994 Mr. Corrado received a Business Week magazine IDEA Gold Award, and he recently received an IBM Program Management Excellence Award for his management role in the development of the z900 server.

Gary F. Goth IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (gfgoth@us.ibm.com). Mr. Goth is a Senior Technical Staff Member in the Thermal Engineering Department in the IBM Server Group. He received his bachelor's degree from Princeton University and master's degrees from Rensselaer Polytechnic Institute and Union College. Mr. Goth has received an IBM Outstanding Invention Award and three IBM Outstanding Technical Achievement Awards; he holds 14 U.S. patents. He has been the lead thermal engineer of G2 through G6, zSeries, and other high-end servers, and has been responsible for air and refrigerant cooling of numerous logic systems. He is a member of ASME.

Sushumna Iruvanti IBM Technology Group, East Fishkill facility, Hopewell Junction, New York 12533 (iruvanti@us.ibm.com). Dr. Iruvanti is a Senior Engineer in the Interconnect Products Development group. He received his B.Tech. degree from Madras University, India, his M.S. degree from Clarkson University, and his Ph.D. degree from the State University of New York at Buffalo, all in chemical engineering. He has received an IBM Corporate Award and an IBM Outstanding Innovation Award for the development of advanced thermal compounds and flat-plate cooling technologies. Dr. Iruvanti holds more than twenty patents, and he has received seven IBM Invention Achievement Plateau Awards. He is a member of AIChE and IMAPS.

Matthew A. Nobile IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (nobile@us.ibm.com). Dr. Nobile is a Senior Engineer in the IBM Server Group, responsible for acoustics and noise-control engineering for zSeries products. He received his B.S. degree in electrical engineering from Cornell University, his M.S. degree in acoustical engineering from Pennsylvania State University, and his Ph.D. degree in acoustics, also from Pennsylvania State University. He is a Fellow of the Acoustical Societyof America and a Board Certified Member of the Institute of Noise Control Engineering; he serves as Technical Director of the NVLAP-accredited IBM Hudson Valley Acoustics Laboratory. He is active on ANSI and ISO standards committees and ITI industry groups, and is currently on the Board of Directors of INCE. Dr. Nobile has reached the third-level plateau of the IBM Publication Achievement Awards.

Budy D. Notohardjono IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (budy@us.ibm.com). Dr. Notohardjono is a Senior Engineer in the Mechanical Analysis Shock and Vibration Department in the IBM Server Group. He received his Ph.D. degree in mechanical engineering from the University of Wisconsin at Madison in 1984, and his M.B.A. degree in finance from New York University in 1997. He has received two IBM Outstanding Technical Achievement Awards and holds several U.S. patents. He is a registered Professional Engineer in the state of New York.

John H. Quick IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (jhquick@us.ibm.com). Mr. Quick is a Senior Engineer responsible for high-end eServer I/O logic card development; he has more than thirty years in the electronic packaging field. He received a B.S. degree in technical management from the State University of New York at New Paltz. Prior to joining IBM in 1981, he developed electronic packaging for military and commercial products. His previous IBM assignments in the Kingston and Poughkeepsie laboratories include roles as design team leader responsible for ESCON director and channel card designs. Mr. Quick has received an IBM Outstanding Technical Achievement Award for his work in packaging z900 card designs.

Edward J. Seminaro IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (seminaro@us.ibm.com). Mr. Seminaro is the Director of Server System Design and Architecture and a Distinguished Engineer in the IBM Server Group. He and his team are responsible for establishing and executing the system design of the IBM iSeries and pSeries UNIX product family. He received a B.S. degree in electrical engineering from Rutgers University and has done graduate work in electrical engineering at Syracuse University. Mr. Seminaro has been involved in the design, development, and manufacturing of S/390 and UNIX servers for more than 19 years in both management and technical roles. He has detailed technical expertise in the areas of power, packaging, and cooling. Mr. Seminaro has received five IBM Outstanding Technical Achievement Awards; he holds eight patents and has received two IBM Invention Achievement Plateau Awards.

Kwok M. Soohoo IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601 (ksoohoo@us.ibm.com). Mr. Soohoo is a Senior Engineer responsible for high-end pSeries and zSeries server product EMC development; his previous assignments in the Poughkeepsie Electromagnetic Compatibility Laboratory include roles as compliance test team leader responsible for worldwide compliance sign-off, and principal EMC development engineer for S/370, S/390, and PPS systems for more than twenty years. He received a B.S. degree in physics from Fordham University, pursued graduate studies in geophysics and computer science at Columbia University, and received an M.S. degree in electrical engineering from Union College. He is a Senior Member of the IEEE, Technical Session Chairman for the 2000 International IEEE EMC Symposium in Washington, DC, Technical Session Chairman for the 2002 International IEEE EMC Symposium in Beijing, and a Senior NARTE Certified EMC and ESD Control Engineer.

Chang-yu Wu IBM Corporate Division, Route 100, Somers, New York (changywu@us.ibm.com). Dr. Wu is a Senior Technical Staff Member and Program Director in charge of Asia Pacific Regional EMC/Telecom/Safety Regulatory affairs. He received the B.S., M.S., and Ph.D. degrees in electrical engineering from Taiwan University, the University of Missouri, and Syracuse University, respectively, joining IBM in 1966. Dr. Wu was a visiting professor at Union College and has lectured extensively on electromagnetic compatibility. He is an IEEE Fellow and an Academic Advisor to the Chinese Electronics Standardization Institute.