|
|
 | |  |
Volume 46, Number 6, 2002
System-on-a-Chip and Packaging |
|
Table of contents:
 HTML PDF | |
This article:
HTML PDF | Copyright info |
| | | |
| | |
An advanced multichip module (MCM) for high-performance UNIX servers - References
|
|
by
J. U. Knickerbocker, F. L. Pompeo, A. F. Tai, D. L. Thomas, R. D. Weekly, M. G. Nealon, H. C. Hamel, A. Haridass, J. N. Humenik, R. A. Shelleman, S. N. Reddy, K. M. Prettyman, B. V. Fasano, S. K. Ray, T. E. Lombardi, K. C. Marston, P. A. Coico, P. J. Brofman, L. S. Goldmann, D. L. Edwards, J. A. Zitz, S. Iruvanti, S. L. Shinde, and H. P. Longworth
|
| |
|
References
-
J. M. Tendler, J. S. Dodson, J. S. Fields, Jr., H. Le, and B. Sinharoy, “POWER4 System Microarchitecture,”
IBM J. Res. & Dev. 46, No. 1, 5–26 (January 2002).
-
P. Walling, A. Tai, and H. Hamel, “High Bandwidth Low Latency Chip-to-Chip Interconnects Using High Performance MIC Glass Ceramic POWER4® MCM,”
Proceedings of the Tenth IEEE Topical Meeting on Electrical Performance of Electronic Packaging,
2001, pp. 299–302.
-
R. R. Tummala, J. U. Knickerbocker, S. H. Knickerbocker, L. W. Herron, R. W. Nufer, R. N. Master, M. O. Neisser, B. M. Kellner, C. H. Perry, J. N. Humenik, and T. F. Redmond, “High Performance Glass Ceramic/Copper Multilayer Substrate with Thin-Film Redistribution,”
IBM J. Res. & Dev. 36, No. 5,
889–904 (September 1992).
-
P. J. Brofman, S. K. Ray, and K. F. Beckham, “Electrical Connections to the Thermal Conduction Modules of the IBM Enterprise System/9000 Water-Cooled Processors,”
IBM J. Res. & Dev. 36, No. 5, 921–933 (September 1992).
-
G. Katopis, D. Becker, and H. Stoller, “First Level Package Design Considerations for the IBM S/390 G5 Server,”
Proceedings of the IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, October
1998, pp. 15–16.
-
A. Plachy, B. Fasano, R. Indyk, D. O'Connor, and S. Reddy, “Glass Ceramic Substrates for Flip Chip Packages,”
MicroNews 4, No. 4, 25–27 (July 1998).
-
Microelectronics Packaging Handbook, R. R. Tummala, E. J. Rymaszewski, and A. J. Klopfenstein, Eds., Van Nostrand Reinhold, New York,
1989, pp. 14, 30, 32, 369, 720.
-
L. W. Herron, R. N. Master, and R. R. Tummala, “Method of Making Multilayered Glass-Ceramic Structures Having an Internal Distribution of Copper-Based Conductors,” U.S. Patent 4,234,367,
1980.
-
P. L. Flaitz, A. M. Flanagan, J. M. Harvilchuck, L. W. Herron, J. U. Knickerbocker, R. W. Nufer, C. H. Perry, S. N. Reddy, and S. P. Young, “Method and Means for Co-Sintering Ceramic/Metal MLC Substrates,” U.S. Patent 5,130,067,
1992.
-
E. H. Laine and P. M. O'Leary, “IBM Chip Packaging Roadmap,”
IBM MicroNews 5, No. 3, 22–25 (1999).
-
G. Katopis, D. Becker, H. Smith, and H. Stoller, “MCM-C/D Design for the CMOS Implementation of the S/390 System,”
Proceedings of the 47th IEEE Conference on Electronic Components and Technology,
1997, pp. 479–485.
-
M. J. Ellsworth, H. Hamel, and E. D. Perfecto, “A High Density, High Performance MCM-D/C Package: A Design, Electrical and Process Perspective,”
Proceedings of the 46th IEEE Conference on Electronic Components and Technology,
1996, pp.
821–828.
-
P. J. Brofman, K. J. Puttlitz, K. A. Stalter, and C. Woychik, “Flip-Chip Die Attach Technology,” Area Array Interconnection Handbook,
K. J. Puttlitz and P. A. Totta, Eds., Kluwer Academic Publishers, Boston,
2001, p. 343.
-
S. K. Ray, K. Beckham, and R. Master, “Flip-Chip Interconnection Technology for Advanced Thermal Conduction Modules,”
Proceedings of the 41st IEEE Conference on Electronic Components and Technology,
1991, pp. 772–778.
-
K. A. Stalter, R. A. Jackson, and D. C. Linnell, “Low-Cost, High Reliability Flip-Chip Removal for Multichip Modules,”
Proceedings of the 49th IEEE Conference on Electronic Components and Technology,
1999, pp. 446–450.
-
N. G. Koopman, T. C. Reily, and P. A. Totta, “Chip-to-Package Interconnections,” Microelectronics Packaging Handbook,
R. R. Tummala, E. J. Rymaszewski, and A. J. Klopfenstein, Eds., Van Nostrand Reinhold, New York,
1989, pp. 361–391.
-
D. W. Wang and K. I. Papathomas, “Encapsulant for Fatigue Life Enhancement of Controlled-Collapse Chip Connection (C4),”
IEEE Trans. Components, Hybrids, Manuf. Technol. 16, No. 8, 863–867 (December 1993).
-
S. L. Buchwalter, M. E. Edwards, D. Gamata, M. A. Gaynes, and S. K. Tran, “Underfill: The Enabling Technology for Flip-Chip Packaging,”
Area Array Interconnection Handbook,
K. Puttlitz and P. A. Totta, Eds., Kluwer Academic Publishers, Boston,
2001, pp. 458, 464.
-
T. Lombardi, F. Pompeo, J. Coffin, D. Plouffe, and C. Reynolds, “Rapid Cure Encapsulant for Use in Ceramic Chip-Carrier Applications,”
IBM MicroNews 5, No. 4, 26–28 (1999).
-
K. J. Puttlitz and L. S. Goldmann, “Product Connector Technology,” Ch. 21 of
Area Array Interconnection Handbook,
K. J. Puttlitz and P. A. Totta, Eds., Kluwer Academic Publishers, Boston,
2001.
-
A. S. Tetelman and A. J. McEvily, The Mechanics of Fracture, Wiley, New York,
1967.
-
J. N. Humenik and J. E. Ritter, “Stress Corrosion of Alumina Substrates,”
J. Mater. Sci. 14, No. 5, 626–632 (1979).
|
|
|
|
|
