Biographical sketches of authors

John U. Knickerbocker IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (knickerj@us.ibm.com). Dr. Knickerbocker is an IBM Distinguished Engineer and is Director of World Wide Development in the InterConnect Products (ICP) organization within the IBM Microelectronics Division at the IBM East Fishkill facility. He received B.S. and M.S. degrees in ceramic engineering in 1977 and 1978, respectively, from the State University of New York at Alfred and his Ph.D. in ceramic engineering in 1982 from the University of Illinois at Champaign–Urbana. He subsequently joined IBM at the East Fishkill facility, where he has held a series of engineering and management assignments and currently focuses on flip-chip packaging technology development, including thermal solutions, chip-to-carrier interconnections, ceramic and organic chip carriers, chip carriers to boards and cards, PWBs and microcards, lead reduction and elimination, and intellectual property development. Dr. Knickerbocker has received an IBM Corporate Award and three Division Awards, including IBM Outstanding Achievement Awards and an IBM Patent Portfolio Award. He has authored or co-authored 96 U.S. patents or patent applications and 16 papers and publications; he has served as the IBM representative on the SEMATECH Focus Technical Advisory Board for Packaging and has served with multiple universities on technical advisory boards. He is a member of IMAPS and a Fellow of the American Ceramic Society.

Frank L. Pompeo IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (pompeo@us.ibm.com). Mr. Pompeo joined the IBM East Fishkill facility in 1982 after receiving his B.Eng. degree in metallurgical engineering in 1982 and his M.S. degree in materials science in 1987, both from Stevens Institute of Technology. Currently a Senior Engineering Development manager for module interconnection technology, he has held a series of management and executive technical staff assignments focusing on ceramic and organic chip carrier and PWB interconnection processes. Mr. Pompeo holds 25 patents and has co-authored 11 external publications in the areas of module interconnections and assembly. He has received one IBM Outstanding Achievement Award and two IBM Division Excellence Awards for his module packaging contributions.

Alice F. Tai IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (alicetai@us.ibm.com). Dr. Tai joined IBM in 1987 after receiving her Ph.D. in chemistry from the University of California at Los Angeles. She has held technical and managerial positions in the plating and thin-film processing areas. Dr. Tai is currently a Senior Engineer responsible for the Regatta packaging application and program management. She holds one patent and has published several internal technical papers.

Donald L. Thomas IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (thomasdo@us.ibm.com). Mr. Thomas joined IBM in 1988. He holds a B.S. degree in electrical and computer engineering from Clarkson University and a master's degree from Syracuse University in computer engineering. He is currently a Senior Engineer responsible for the technical marketing strategy for first- and second-level packaging that the IBM Microelectronics Division delivers to the IBM Server Group. Mr. Thomas was the lead packaging designer and subsequently the packaging application and design manager for the previous five generations of IBM mainframe servers.

Roger D. Weekly IBM Server Group, 11400 Burnet Road, Austin, Texas 78758 (weekly@us.ibm.com). Mr. Weekly joined IBM in 1976 after receiving a B.S. degree from Worcester Polytechnic Institute in 1975 and an M.S. degree from Stanford in 1976, both in electrical engineering. He initially worked with power-supply development for IBM low- to mid-range systems in printers, personal computers, and UNIX-class workstations. As part of this activity, he was lead designer of a set of CMOS ICs for switched-mode power supply control. In 1986 Mr. Weekly taught at Tuskegee University, Alabama, under the IBM Faculty Loan Program. He subsequently spent several years during the emergence of the Fibre Channel Standard developing fiber optics adapters and switches. In 1996 he moved to the POWER3 processor development group, with responsibility for the electrical application support of this processor family in IBM products. Since 1998 Mr. Weekly has been involved in the first- and second-level packaging of IBM POWER processors and their support chips. He has received several IBM Outstanding Technical Achievement Awards for his work in these areas.

Michael G. Nealon IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (nealon@us.ibm.com).

Harvey C. Hamel IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (hhamel@us.ibm.com). Mr. Hamel received a B.S.E.E. degree from Wayne State University and an M.S.E. degree from Syracuse University, joining IBM in Poughkeepsie, New York, in 1964 as a designer of special circuits. He began work on wide-band amplifiers, microwave microstrip filters, and directional couplers, and his work has included designing Josephson circuits and servo systems and developing techniques to analyze the stability of switching regulators. After a time spent modeling bipolar structures, he has worked in the general area of electrical packaging analysis and design. Mr. Hamel's interest is in frequency-dependent lossy coupled structures and how they relate to signal bandwidth, crosstalk, and power integrity. His present work is concerned with the modeling of the electrical limitations and tradeoffs associated with MCMs and interconnections. He holds numerous patents in the packaging and interconnection field.

Anand Haridass IBM Server Group, 11400 Burnet Road, Austin, Texas 78758 (anandh@us.ibm.com). Mr. Haridass received the B.E. degree from KREC, Surathkal, India, in 1995 and the M.S.E.E. degree from the Georgia Institute of Technology, Atlanta, in 1997. That same year, he joined the IBM Somerset Design Center in Austin, Texas, and was involved in first-level packaging for PowerPC processors designed for Apple. Since 1998, Mr. Haridass has been an integral part of the IBM Server Packaging Team, involved in modeling, simulation, and measurement of packages and issues related to high-speed signal integrity. He is pursuing a Ph.D. degree in the field of electromagnetic modeling at the University of Texas through the IBM Work-Study Program.

James N. Humenik IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (humenik@us.ibm.com). Dr. Humenik is a Senior Technical Staff Member at the IBM East Fishkill facility. He received a B.S. degree in 1970, an M.S. degree in 1972, and a Ph.D. degree in 1974, all in ceramic engineering from the University of Illinois at Urbana–Champaign. He joined IBM at the East Fishkill facility, where he has held a series of management and technical staff assignments focusing primarily on the materials and processes used to fabricate microelectronic packages. Dr. Humenik has authored or co-authored ten papers and holds 19 U.S. patents. He is a Fellow of the American Ceramic Society, where he also serves as the IBM representative.

Richard A. Shelleman IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (shellema@us.ibm.com). Dr. Shelleman received his Ph.D. degree in ceramic science from The Pennsylvania State University in 1988. He joined the IBM Microelectronics Division in East Fishkill in the packaging development group in 1988 as a Staff Engineer. He is now an Advisory Engineer in the InterConnect Products group, responsible for glass-ceramic sintering development. Dr. Shelleman is a member of the American Ceramic Society and the Materials Research Community in IBM.

Srinivasa N. Reddy IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (snreddy@us.ibm.com). Dr. Reddy is a Senior Engineer in Ceramic Packaging Development. He received B.E. and M.E. degrees in metallurgy from the Indian Institute of Science and a Ph.D. in materials science from Marquette University. Before joining IBM in 1982, he worked as a postdoctoral researcher at Ohio State University and as a research engineer at the Amoco Research Center. His specialty is the application of thermodynamic and kinetic principles to the development of high-temperature processes. Dr. Reddy holds 28 patents and has been a leading technical contributor in the development of high-performance glass-ceramic technology.

Kevin M. Prettyman IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (kmpretty@us.ibm.com). Dr. Prettyman joined IBM in 1981. He received a B.S. degree in chemistry from Brigham Young University, M.E. and Ph.D. degrees in materials science and engineering from The University of Utah, and an M.B.A. from the New York University Stern School of Business. He has worked as a process engineer in Bond Assembly and Test, as a development engineer in a Materials Development Group, as a development engineering manager in Sintering, Measurements, and Test, and as a product line manager and product development team leader in the Interconnect Products Business Line Management Area. He has been a leader in new materials understanding and qualification and has helped bring to market the IBM high-performance glass-ceramic (HPGC) product line. Dr. Prettyman holds ten U.S. patents and has eight technical publications.

Benjamin V. Fasano IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (bfasano@us.ibm.com). Dr. Fasano joined IBM in 1992 after receiving B.S., M.S., and Ph.D. degrees in ceramic engineering from Rutgers University. He developed high secondary emission overcoat and glass materials for plasma display panels at the IBM Kingston, New York, facility. Dr. Fasano transferred to the Packaging Development group for the IBM high-performance glass-ceramic modules using thin films in 1985, and was responsible for raw materials and supplier qualifications for ceramic and metallization powders and organics used in the manufacturing process. He also helped develop the tape casting process for greensheets. Dr. Fasano has been the technical team leader for the high-performance glass-ceramic product development team since its inception. His current interests include high-frequency packaging and structures. He holds 36 U.S. patents in the packaging field.

Sudipta K. Ray IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (skray@us.ibm.com). Dr. Ray is a Senior Engineer at the IBM East Fishkill facility. He joined IBM at the Thomas J. Watson Research Center in 1979 after receiving a B.S. degree from Calcutta University, an M.S. degree in physics from Delhi University, and a Ph.D. degree in solid-state physics from the University of Virginia. Dr. Ray has held a series of management and technical staff assignments focusing primarily on the materials and processes used for first- and second-level microelectronic package interconnections, and thin-film wiring used on ceramic packages. He has authored or co-authored more than 25 papers and holds 30 U.S. patents. Dr. Ray is a Senior Member of the IEEE Computer Packaging and Manufacturing Technology Society, where he also serves as a member of the Advanced Packaging Committee.

Thomas E. Lombardi IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (lombat@us.ibm.com). Dr. Lombardi received B.S. and M.S. degrees in ceramic engineering from Rutgers University in 1984 and 1986, respectively. He subsequently joined IBM and worked as a development engineer in the areas of lamination and sintering of alumina and glass-ceramic packages. Since receiving his Ph.D. degree from Rutgers University in 1996, he has worked on a variety of projects related to bond and assembly development. He is currently a Senior Engineer responsible for underfill activities, C4 chip joining, and fine-pitch development on advanced ceramic packages. Dr. Lombardi is a member of the American Ceramic Society and an author or coauthor of nine patents.

Kenneth C. Marston IBM Microelectronics Division, 2455 South Road, Poughkeepsie, New York 12601 (kmarston@us.ibm.com). Mr. Marston received a B.E.M.E. degree from the State University of New York at Stony Brook and an M.S.M.E. degree from the University of Minnesota, with a concentration in thermal sciences. He has 11 years' experience in Advanced Module Manufacturing, including development of temperature control systems for module test and burn-in equipment; process responsibility for temperature stress, solder reflow operations, and encapsulation; and project management for several products manufactured in Poughkeepsie. He is currently an Advisory Engineer.

Patrick A. Coico IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (coico@us.ibm.com). Mr. Coico is an electronic module development engineer at the IBM Microelectronics facility in East Fishkill, New York. He joined IBM in 1985. His areas of expertise include multichip module design, hermetic and nonhermetic sealing, land grid array interconnects, and package mechanical considerations. Much of his effort over the past 14 years has been focused on the large modules used in the IBM Enterprise Servers. Mr. Coico has made contributions that have enabled many innovations to these module designs. He received his B.S.M.E. degree from the State University of New York at Buffalo and his M.S.M.E. degree from the University of California at Berkeley. He is a registered Professional Engineer in the state of California.

Peter J. Brofman IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (brofman@us.ibm.com). Dr. Brofman is an IBM Distinguished Engineer in the InterConnect Products group at the IBM East Fishkill facility. He received a B.S. degree in materials engineering in 1975, an M.S. degree in physical metallurgy, an M.B.A. degree in 1978, and a Ph.D. degree in physical metallurgy in 1980, all from Rensselaer Polytechnic Institute. He subsequently joined IBM at the East Fishkill facility, where he has held a series of management and technical staff assignments all focusing on module interconnection processing. He has received two IBM Outstanding Achievement Awards, an IBM Outstanding Innovation Award, and an IBM Division Excellence Award; he has authored or co-authored 22 papers and 18 U.S. patents. Dr. Brofman serves as the IBM representative on the Semiconductor Corporation Technical Advisory Board for packaging and interconnects. He is a member of the American Society for Metals, International and the International Microelectronics and Packaging Society.

Lewis S. (Lew) Goldmann IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (goldmann@us.ibm.com). Mr. Goldmann received a B.S. degree in pre-engineering and liberal arts from Queens College, City University of New York; a B.S. degree in mechanical engineering from Columbia University; and an M.S.M.E. degree from MIT. For the last twenty years he has been involved in the mechanical evaluation of electronic packages, interconnections, devices, and materials, and is currently a Senior Technical Staff Member in Ceramic Module Development. He previously contributed to the development of C4 interconnections and early versions of the IBM thermal conduction module.

David L. Edwards IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (dledward@us.ibm.com). Mr. Edwards joined IBM in 1983 after receiving his B.S. degree in mechanical engineering from Clarkson College and his M.S. degree in mechanical engineering from Cornell University. He has held several technical and managerial positions at the IBM Poughkeepsie and East Fishkill facilities, working in the areas of system cooling, ceramic module thermal/mechanical design, and module bond and assembly. Mr. Edwards is currently a Senior Engineer, specializing in the cooling of high-power ceramic modules. He has achieved the IBM 11th level Invention Plateau, and holds 26 U.S. patents and several foreign patents.

Jeffrey A. Zitz IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (jeffzitz@us.ibm.com). Mr. Zitz is the lead microprocessor/ASIC packaging engineer at IBM East Fishkill Microelectronics facility. During his 14 years with IBM, he has applied his diverse engineering expertise in the areas of materials, mechanical, thermal, and statistical modeling, reliability, and manufacturing to IBM ceramic and organic chip carriers and computer systems. He led the development of bare-die flip-chip ceramic carriers, and, more recently, development of the Direct Lid Attach (DLA) package utilized by IBM and other flip-chip package manufacturers. His innovations appear across the IBM ASIC and PowerPC die product offerings, and have been key to higher package performance at lower cost. Mr. Zitz received his B.S.M.E. and M.S.M.E. degrees from Rensselaer Polytechnic Institute; he is a registered Professional Engineer in the State of New York.

Sushumna Iruvanti IBM Technology Group, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (iruvanti@us.ibm.com). Dr. Iruvanti is a Senior Engineer in the InterConnect Products Development group. He received his B.Tech. degree from Madras University, India, his M.S. degree from Clarkson University, and his Ph.D. degree from the State University of New York at Buffalo, all in chemical engineering. He has received an IBM Corporate Award and an IBM Outstanding Innovation Award for his work in the development of advanced thermal compounds and flat-plate cooling technologies. He holds 21 patents and has received seven IBM Invention Achievement Plateau Awards. Dr. Iruvanti is a member of AIChE and IMAPS.

Subhash L. Shinde IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (shinde@us.ibm.com). Dr. Shinde joined IBM at the Thomas J. Watson Research Center in 1986 after receiving B.Tech. and M.Tech. degrees from the Indian Institute of Technology, Bombay, and a Ph.D. degree in materials science from Stanford University. At the Research Center, his work was concentrated primarily on electrical and magnetic properties of granular superconductors, and interfaces in such systems. Dr. Shinde edited a book in this area published by Springer-Verlag. He also worked on interfacial interactions in metal/ceramic systems related to the IBM electronic packages. In 1992 he moved to the IBM Microelectronics Division and initiated a project on low-temperature sintering aluminum nitride for thermally efficient electronic packages. He holds more than 15 patents in this area. Dr. Shinde's current work focuses on issues related to optoelectronic packaging and thermal management materials development. He is a member of the American Physical Society, the American Ceramic Society, and the Materials Research Society. He holds 33 patents, has published 26 papers, and is currently editing a book on high-thermal-conductivity materials.

Hai P. Longworth IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (longworh@us.ibm.com). Ms. Longworth is a Senior Engineer in the Ceramic Packaging group. She is responsible for reliability assurance of glass ceramics, C4s, thin films, and packaging product qualification. She joined IBM in 1992 after receiving an Sc.D. degree in electronic materials engineering from the Massachusetts Institute of Technology. She received an M.S. degree in metallurgical engineering from Michigan Technological University and B.S. degrees in physics and chemistry from Saigon University. She had worked as an analytical chemist and supervisor at Howmet Corporation in Michigan. Ms. Longworth holds one patent; she has published and presented 18 technical papers on microstructures vs. properties, electromigration, thin film, packaging reliability, and qualification.