Biographical sketches of authors

John S. Corbin IBM Server Group, 11400 Burnet Road, Austin, Texas 78758 (jcorbin@us.ibm.com). Mr. Corbin received his B.S. and M.S. degrees in mechanical engineering from the University of Texas at Austin in 1972 and 1974, respectively. He joined IBM in 1974 and spent ten years in printer development, working primarily in the area of motion control. This was followed by six years in the System Technology Division Packaging Laboratory in Austin, applying finite element techniques in the area of mechanical-packaging reliability. He is currently a Senior Engineer in the Server Group in Austin, Texas, where he has spent ten years in AIX workstation and server mechanical packaging development. Mr. Corbin is a registered Professional Engineer in the state of Texas.

Ciro N. Ramirez Thornhill & Associates, 550 Oak Grove Road, Leander, Texas 78641 (forensc@attglobal.net). Dr. Ramirez received B.S. and M.M.E. degrees in mechanical engineering from Rice University in 1973 and 1974, and a Ph.D. degree in mechanical engineering from the University of Texas at Austin in 1991. He joined IBM in 1974, working in dictation and printer development, electronic packaging, and AIX workstation and server development. He has extensive experience in mechanical design and structural and dynamic analysis. Dr. Ramirez is a licensed Professional Engineer in the state of Texas and is currently a full-time engineering consultant.

Danny E. Massey IBM Server Group, 11400 Burnet Road, Austin, Texas 78758 (masseyd@us.ibm.com). Mr. Massey joined IBM in 1980 and has spent most of his IBM career in card and electronic packaging development. He was instrumental in the development of SLC and I2T substrate processes, as well as dendritic interconnect technology. He was a key technical leader in the development and implementation of LGA technology within IBM, and is currently the manager of a card logic development group in Austin.