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IBM Journal of Research and Development  
Volume 45, Number 5, 2001
Advanced Semiconductor Lithography.
 Table of contents: arrowHTML arrowPDF arrowASCII   This article: arrowHTML arrowPDF arrowASCII arrowCopyright info
   

Printing meets lithography: Soft approaches to high-resolution patterning - References
by B. Michel, A. Bernard, A. Bietsch, E. Delamarche, M. Geissler, D. Juncker, H. Kind, J.-P. Renault, H. Rothuizen, H. Schmid, P. Schmidt-Winkel, R. Stutz, and H. Wolf

References

  1. R. Goepper and J. Lee-Kalisch, “Korea: Die alten Königreiche,” Kulturstiftung Ruhr Essen (Katalog) Museum Rietberg, Gablerstrasse 15, CH-8002 Zurich, Switzerland, 2000, p. 258.
  2. H. Kipphan, Handbuch der Printmedien: Technologien und Produktionsverfahren, Springer, Berlin, 2000.
  3. J. M. Adams, D. D. Faux, and J. J. Rieber, Printing Technology, 4th ed., Delmare Publishers, Albany, NY, 1996.
  4. S. Leppävuori, J. Vaeaenaenen, M. Lahti, J. Remes, and A. Uusimaeki, “A Novel Thick Film Technique, Gravure Offset Printing, for the Realization of Fine-line Sensor Structures,” Sensors & Actuators A 41–42, 593 (1994).
  5. M. Lahti, S. Leppävuori, and V. Lantto, “Gravure-Offset-Printing Technique for the Fabrication of Solid Films,” Appl. Surf. Sci. 142, 367 (1999).
  6. Y. Mikami, Y. Nagae, Y. Mori, K. Kubawara, T. Saito, H. Hayama, H. Asada, Y. Akimoto, M. Kobayashi, S. Okazaki, K. Asaka, H. Matsui, K. Nakamura, and E. Kaneko, “A New Patterning Process Concept for Large-Area Transistor Circuit Fabrication Without Using Optical Mask Aligner,” IEEE Trans. Electron Devices 41, 306 (1994).
  7. P. M. Harrey, P. S. A. Evans, B. J. Ramsey, and D. Harrison, “A Novel Manufacturing Process for Capacitors Using Offset Lithography,” Proceedings of the 1st International Symposium on Environmentally Conscious Designs and Inverse Manufacturing, Tokyo, 1999, p. 842.
  8. G. Love, G. Maher, and N. Long, “Pad Printer,” Proceedings of the IEEE International Symposium on Electronic Manufacturing Technology (IEMT), Piscataway, NJ, 1996, p. 167.
  9. H. Gleskova, E. Y. Ma, S. Wagner, and D. S. Shen, “A Si:H TFT Fabricated by Electrophotographic Printing,” 1996 Display Manufacturing Technology Conference, Digest of Technical Papers, p. 97.
  10. R. H. Detig, “Electrostatic Printing of Functional Materials, a Versatile Manufacturing Process for Flat Panel Displays,” Proceedings of Display Works 99, Manufacturing Technology Conference, San Jose, CA, 1999, p. 97.
  11. R. W. Sabnis, “Color Filter Technology for Liquid Crystal Displays,” Displays 20, 119 (1999).
  12. E. Cullmann, “Excimer Laser Applications in Contact Printing,” Semicond. Int. 8, 332 (1985).
  13. H. Huber, U. Scheunemann, E. Cullmann, and W. Rohrmoser, “Application of X-ray Steppers Using Optical Alignment,” Solid State Technol. 33, 59 (1990).
  14. S. K. Ghandi, VLSI Fabrication Principles, John Wiley & Sons, New York, 1983.
  15. G. L. T. Chiu and J. M. Shaw, “Optical Lithography: An Introduction,” IBM J. Res. Develop. 41, 3 (1997).
  16. A. Kumar and G. M. Whitesides, “Features of Gold Having Micrometer to Centimeter Dimensions Can Be Formed Through a Combination of Stamping with an Elastomeric Stamp and an Alkanethiol ‘Ink’ Followed by Chemical Etching,” Appl. Phys. Lett. 63, 2002 (1993).
  17. A. Kumar, N. L. Abbott, E. Kim, H. Biebuyck, and G. M. Whitesides, “Patterned Self-Assembled Monolayers and Meso-Scale Phenomena,” Acc. Chem. Res. 28, 219 (1995).
  18. E. Delamarche, A. C. F. Hoole, B. Michel, S. Wilkes, M. Despont, M. E. Welland, and H. A. Biebuyck, “Making Gold Nanostructures Using Self-Assembled Monolayers and a Scanning Tunneling Microscope,” J. Phys. Chem. 101, 9263 (1997).
  19. H. A. Biebuyck, N. B. Larsen, E. Delamarche, and B. Michel, “Lithography Beyond Light: Microcontact Printing with Monolayer Resists,” IBM J. Res. & Dev. 41, 159 (1997).
  20. Y. Xia and G. M. Whitesides, “Soft Lithography,” Angew. Chem. Int. Ed. 37, 550 (1998).
  21. S. Walheim, R. Muller, M. Sprenger, E. Loser, and J. Mlynek, “Patterning Self-Assembled Monolayers on Oxide Surfaces Using a Lift-Off Technique,” Adv. Mater. 11, 1431 (1999).
  22. N. L. Jeon, I. S. Choni, G. M. Whitesides, N. Y. Kim, P. E. Laibinis, Y. Harada, K. R. Finnie, G. S. Girolami, and R. G. Nuzzo, “Patterned Polymer Growth on Silicon Surfaces Using Microcontact Printing and Surface Initiated Polymerization,” Appl. Phys. Lett. 75, 4201 (1999).
  23. D. Qin, Y. Xia, B. Xu, H. Yang, C. Zhu, and G. M. Whitesides, “Fabrication of Ordered Two-Dimensional Arrays of Micro- and Nanoparticles Using Patterned Self-Assembled Monolayers as Templates,” Adv. Mater. 11, 1433 (1999).
  24. R. J. Jackman, S. T. Brittain, A. Adams, H. Wu, M. G. Prentiss, S. Whitesides, and G. M. Whitesides, “Three-Dimensional Metallic Microstructures Fabricated by Soft Lithography and Microelectrodeposition,” Langmuir 15, 826 (1999).
  25. T. Deng, H. K. Wu, S. T. Brittain, and G. M. Whitesides, “Prototyping of Masks, Masters, and Stamps/Molds for Soft Lithography Using an Office Printer and Photographic Reduction,” Anal. Chem. 72, 3176 (2000).
  26. R. R. Shah, D. Merreceyes, M. Husemann, I. Rees, N. L. Abbott, C. J. Hawker, and J. L. Hedrick, “Using Atom Transfer Radical Polymerization to Amplify Monolayers of Initiators Patterned by Microcontact Printing into Polymer Brushes for Pattern Transfer,” Macromolecules 33, 597 (2000).
  27. W. T. S. Huck, A. D. Strook, and G. M. Whitesides, “Synthesis of Geometrically Well Defined, Molecularly Thin Polymer Films,” Angew. Chem. Intl. Ed. 39, 1058 (2000).
  28. A. J. Black, P. F. Nealey, J. H. Thywissen, M. Deshpande, N. El-Zein, G. N. Maracas, M. Prentiss, and G. M. Whitesides, “Microfabrication of Two Layer Structures of Electrically Isolated Wires Using Self-Assembly to Guide the Deposition of Insulating Organic Polymer,” Sensors & Actuators 86, 96 (2000).
  29. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, “Imprint of Sub-25 nm Vias and Trenches in Polymers,” Appl. Phys. Lett. 67, 3114 (1995).
  30. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, “Imprint Lithography with 25-Nanometer Resolution,” Science 272, 85 (1996).
  31. A. Lebib, Y. Chen, J. Bourneix, F. Carcenac, E. Cambril, L. Cournaud, and H. Launois, “Nanoimprint Lithography for Large Area Pattern Replication,” Microelectron. Eng. 46, 319 (1999).
  32. A. Lebib, Y. Chen, F. Carcenac, E. Cambril, L. Manin, L. Couraud, and H. Launois, “Tri-Layer Systems for Nanoimprint Lithography with an Improved Process Latitude,” Microelectron. Eng. 53, 175 (2000).
  33. H. Schulz, F. Osenberg, J. Engemann, and H.-C. Scheer, “Mask Fabrication by Nanoimprint Lithography Using Anti-Sticking Layers,” Proc. SPIE 3996, 244 (2000).
  34. H. Schift, C. David, M. Gabriel, J. Gobrecht, L. J. Heyderman, W. Kaiser, S. Koeppel, and L. Scandella, “Nanoreplication in Polymers Using Hot Embossing and Injection Molding,” Microelectron. Eng. 53, 171 (2000).
  35. L. Montelius, B. Heidari, M. Graczyk, T. Ling, I. Maximov, and E. L. Sarwe, “Large Area Nanoimprint Fabrication of Sub-100 nm Interdigitated Metal Arrays,” Emerging Lithographic Technologies IV, Proc. SPIE 3997, 442 (2000).
  36. O. J. A. Schueller, S. T. Brittain, and G. M. Whitesides, “Fabrication of Glassy Carbon Microstructures by Soft Lithography,” Sensors & Actuators A 72, 125 (1999).
  37. O. J. A. Schueller, X. M. Zhao, G. M. Whitesides, S. P. Smith, and M. Prentiss, “Fabrication of Liquid-Core Waveguides by Soft Lithography,” Adv. Mater. 11, 37 (1999).
  38. B. Xu, F. Arias, and G. M. Whitesides, “Making Honeycomb Microcomposites by Soft Lithography,” Adv. Mater. 11, 492 (1999).
  39. M. A. Unger, H. P. Chou, T. Thorsen, A. Scherer, and S. R. Quake, “Monolithic Microfabricated Valves and Pumps by Multilayer Soft Lithography,” Science 288, 113 (2000).
  40. C. Bechinger, H. Muffler, C. Schäfle, O. Sundberg, and P. Leiderer, “Submicron Metal Oxide Structures by a Sol–Gel Process on Patterned Substrates,” Thin Solid Films 366, 135 (2000).
  41. M. Colburn, A. Grot, M. Amistoso, B. J. Cho, T. Bailey, J. Ekerdt, S. V. Sreenivasan, J. Hollenhorst, and C. G. Willson, “Step and Flash Imprint Lithography for Sub-100 nm Patterning,” Emerging Lithographic Technologies IV, Proc. SPIE 3997, 453 (2000).
  42. A. Bietsch and B. Michel, “Conformal Contact and Pattern Stability of Stamps Used for Soft Lithography,” J. Appl. Phys. 88, 4310 (2000).
  43. H. Schmid and B. Michel, “Siloxane Polymers for High-Resolution, High-Accuracy Soft Lithography,” Macromolecules 33, 3042 (2000).
  44. Y. Xia, X.-M. Zhao, and G. M. Whitesides, “Pattern Transfer: Self-Assembled Monolayers as Ultrathin Resists,” Microelectron. Eng. 32, 255 (1996).
  45. N. B. Larsen, H. A. Biebuyck, E. Delamarche, and B. Michel, “Order in Microcontact Printed Self-Assembled Monolayers,” J. Amer. Chem. Soc. 119, 3017 (1997).
  46. E. Delamarche, H. Schmid, A. Bietsch, N. B. Larsen, H. Rothuizen, B. Michel, and H. A. Biebuyck, “Transport Mechanisms of Alkanethiols During Microcontact Printing on Gold,” J. Phys. Chem. B 102, 3324 (1998).
  47. L. Libioulle, A. Bietsch, H. Schmid, B. Michel, and E. Delamarche, “Contact-Inking Stamps for Microcontact Printing of Alkanethiols on Gold,” Langmuir 15, 300 (1999).
  48. J. L. Wilbur, H. A. Biebuyck, J. C. McDonald, and G. M. Whitesides, “Scanning Force Microscopies Can Image Patterned SAMs,” Langmuir 11, 825 (1994).
  49. G. P. Lopez, H. A. Biebuyck, and G. M. Whitesides, “SEM Can Form Images of Patterns in SAMs,” Langmuir 9, 1513 (1993).
  50. A. Kumar, H. A. Biebuyck, N. L. Abbott, and G. M. Whitesides, “The Use of SAMs and a Selective Etch to Generate Patterned Gold Features,” J. Amer. Chem. Soc. 114, 9188 (1992).
  51. E. Delamarche, B. Michel, H. Biebuyck, and Ch. Gerber, “Golden Interfaces: The Surface of Self-Assembled Monolayers,” Adv. Mater. 8, 719 (1996).
  52. G. Schmidt, M. Tormen, G. Mueller, L. W. Molenkamp, Y. Chen, A. Lebib, and H. Launois, “Versatile Patterning Process for Semiconductors Based on Microcontact Printing,” Electron. Lett. 35, 1731 (1999).
  53. Y. Chen, A. Lebib, F. Carcenac, H. Launois, G. Schmidt, M. Tormen, G. Mueller, L. W. Molenkamp, M. Liebau, J. Huskens, and S. N. Reinhoudt, “Microcontact Printing and Pattern Transfer with a Tri-Layer Processing,” Microelectron. Eng. 53, 253 (2000).
  54. E. Delamarche, H. Schmid, B. Michel, and H. Biebuyck, “Stability of Molded Polydimethylsiloxane Microstructures,” Adv. Mater. 9, 741 (1997).
  55. K. L. Johnson, Contact Mechanics, Cambridge University Press, Cambridge, England, 1985.
  56. C. D. James, R. Davies, M. Meyer, A. Turner, S. Turner, G. Withers, L. Kam, G. Banker, H. Craighead, M. Isaacson, J. Turner, and W. Shain, “Aligned Microcontact Printing of Micrometer-Scale Poly-L-Lysine Structures for Controlled Growth of Cultured Neurons on Planar Microelectrode Arrays,” IEEE Trans. Biomed. Eng. 47, 17 (2000).
  57. A. Folch and M. A. Schmidt, “Wafer-Level In-Registry Microstamping,” J. Microelectromech. Syst. 8, 85 (1999).
  58. J. A. Rogers, K. E. Paul, and G. M. Whitesides, “Quantifying Distortions in Soft Lithography,” J. Vac. Sci. Technol. B 16, 88 (1998).
  59. T. Burgin, V.-E. Choong, and G. Maracas, “Large Area Submicrometer Contact Printing Using a Contact Aligner,” Langmuir 16, 5371 (2000).
  60. R. Hull and D. Longo, “Development of a Nanoscale Printing Technology for Planar and Curved Surfaces,” Proc. SPIE 3975, 974 (2000).
  61. A. Bietsch, M. A. Schneider, M. E. Welland, and B. Michel, “Electrical Testing of Gold Nanostructures by Conducting Atomic Force Microscopy,” J. Vac. Sci. Technol. B 18, 1160 (2000).
  62. J. F. Bacilek, “Color Photography,” IS&T Ann. Conf. 50, 242 (1997).
  63. R. J. Jackman, J. Duffy, E. Ostuni, N. D. Willmore, and G. M. Whitesides, “Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting,” Anal. Chem. 70, 2280 (1998).
  64. E. Kim, Y. Xia, and G. M. Whitesides, “Micromolding in Capillaries: Applications in Materials Science,” J. Amer. Chem. Soc. 118, 5722 (1996).
  65. E. Delamarche, A. Bernard, H. Schmid, B. Michel, and H. Biebuyck, “Patterned Delivery of Immunoglobulins to Surfaces Using Microfluidic Networks,” Science 276, 779 (1997).
  66. E. Delamarche, A. Bernard, H. Schmid, A. Bietsch, B. Michel, and H. Biebuyck, “Microfluidic Networks for Chemical Patterning of Substrates: Design and Application to Bioassays,” J. Amer. Chem. Soc. 120, 500 (1998).
  67. E. Delamarche, B. Michel, A. Bernard, H. Schmid, E. Haskal, and W. Riess, “Microcontainers for Patterning Substrates with Colored Materials,” IBM Tech. Disclosure Bull. 436, 1443 (2000).
  68. G. T. Hermanson, A. K. Mallia, and P. K. Smith, Immobilized Affinity Ligand Techniques, Academic Press, Inc., New York, 1992.
  69. A. Folch, J. B. Ho, O. Hurtado, D. J. Beebe, and M. Toner, “Microfabricated Elastomeric Stencils for Micropatterning Cell Cultures,” J. Biomed. Mater. Res. 52, 346 (2000).
  70. B. H. Weigl and P. Yager, “Microfluidic Diffusion-Based Separation and Detection,” Science 283, 346 (1999).
  71. M. U. Kopp, A. J. de Mello, and A. Manz, “Chemical Amplification: Continuous-Flow PCR on a Chip,” Science 280, 1046 (1998).
  72. A. Bernard, E. Delamarche, H. Schmid, B. Michel, H. R. Bosshard, and H. Biebuyck, “Printing Patterns of Proteins,” Langmuir 14, 2225 (1998).
  73. C. D. James, R. C. Davis, L. Kam, H. G. Craighead, M. Isaacson, J. N. Turner, and W. Shain, “Patterned Protein Layers on Solid Substrates by Thin Stamp Microcontact Printing,” Langmuir 14, 741 (1998).
  74. A. Bernard, J. P. Renault, B. Michel, H. R. Bosshard, and E. Delamarche, “Microcontact Printing of Proteins,” Adv. Mater. 12, 1067 (2000).
  75. M. Geissler, A. Bernard, A. Bietsch, H. Schmid, B. Michel, and E. Delamarche, “Microcontact-Printing Chemical Patterns with Flat Stamps,” J. Amer. Chem. Soc. 122, 6303 (2000).
  76. G. O. Mallory and J. B. Hajdu, Electroless Plating: Fundamentals and Applications, American Electroplaters and Surface Finishers Society, Orlando, FL, 1990.
  77. W. J. Dressick, C. S. Dulcey, J. H. Georger, G. S. Calabrese, and J. M. Calvert, “Covalent Binding of Pd Catalysts to Ligating Self-Assembled Monolayer Films for Selective Electroless Metal Deposition,” J. Electrochem. Soc. 141, 210 (1994).
  78. E. J. O'Sullivan, A. G. Schrott, M. Paunovic, C. J. Sambucetti, J. R. Marino, P. J. Bailey, S. Kaja, and K. W. Semkow, “Electrolessly Deposited Diffusion Barriers for Microelectronics,” IBM J. Res. & Dev. 42, 607 (1998).
  79. P. C. Hidber, W. Helbig, E. Kim, and G. M. Whitesides, “Microcontact Printing of Palladium Colloids: Micron-Scale Patterning by Electroless Deposition of Copper,” Langmuir 12, 1375 (1996).
  80. H. Kind, M. Geissler, H. Schmid, B. Michel, K. Kern, and E. Delamarche, “Patterned Electroless Deposition of Copper by Microcontact Printing Palladium(II) Complexes on Titanium-Covered Surfaces,” Langmuir 16, 6367 (2000).
  81. H. Schmid, H. Biebuyck, B. Michel, O. J. F. Martin, and N. Piller, “Light-Coupling Masks: An Alternative Lensless Approach to High-Resolution Optical Contact Lithography,” J. Vac. Sci. Technol. B 16, 3422 (1998).
  82. H. Schmid, H. Biebuyck, B. Michel, and O. J. F. Martin, “Light-Coupling Masks for Lensless, Sub-Wavelength Optical Lithography,” Appl. Phys. Lett. 72, 2379 (1998).
  83. J. A. Rogers, K. E. Paul, R. J. Jackman, and G. M. Whitesides, “Generating ~90 Nanometer Features Using Near-Field Contact-Mode Photolithography with an Elastomeric Phase Mask,” Appl. Phys. Lett. 70, 2685 (1997).
  84. J. A. Rogers, A. Dodabalapur, Z. Bao, and H. Katz, “Low-Voltage 0.1 µm Organic Transistors and Complementary Inverter Circuits Fabricated with a Low-Cost Form of Near Field Photolithography,” Appl. Phys. Lett. 75, 1010 (1999).
  85. Y. Chen, F. Carcenac, C. Ecoffe, D. J. Lougnot, and H. Launois, “Mold-Assisted Near Field Optical Lithography,” Microelectron. Eng. 46, 69 (1999).
  86. O. J. F. Martin and N. P. Piller, “Electromagnetic Scattering in Polarizable Backgrounds,” Phys. Rev. E 58, 3909 (1998).
  87. O. J. F. Martin, N. B. Piller, H. Schmid, H. Biebuyck, and B. Michel, “Energy Flow in Light-Coupling Masks for Lensless Optical Lithography,” Opt. Express 3, 280 (1998).
  88. M. Paulus, B. Michel, and O. J. F. Martin, “Near-Field Distribution in Light Coupling-Masks for Contact Lithography,” J. Vac. Sci. Technol. B 17, 3314 (1999).
  89. J. G. Goodberlet and B. L. Dunn, “Deep-Ultraviolet Contact Photolithography,” Microelectron. Eng. 53, 95 (2000).
  90. R. J. Blaikie, M. M. Alkaisi, S. J. McNab, D. R. S. Cumming, R. Cheung, and D. G. Hasko, “Nanolithography Using Optical Contact Exposure in the Evanescent Near Field,” Microelectron. Eng. 46, 85 (1999).
  91. D. J. D. Carter, H. I. Smith, K. W. Rhee, and C. Marrian, “Sub-40 nm Pattern Replication with ±20% Process Latitude by Soft Contact X-ray Lithography,” Proc. SPIE 3676, 70 (1999).
  92. E. Kim, Y. Xia, and G. M. Whitesides, “Polymer Microstructures Formed by Moulding in Microcapillaries,” Nature 376, 581 (1995).
  93. E. Kim, Y. Xia, and G. M. Whitesides, “Micromolding in Capillaries: Applications in Material Science,” J. Amer. Chem. Soc. 118, 5722 (1996).
  94. X. M. Zhao, Y. Xia, and G. M. Whitesides, “Fabrication of Three Dimensional Microstructures: Microtransfer Molding,” Adv. Mater. 8, 837 (1996).
  95. H. Kind, J. M. Bonard, C. Emmenegger, L. O. Nilsson, K. Hernadi, E. Maillard-Schaller, L. Schlapbach, L. Forro, and K. Kern, “Patterned Films of Nanotubes Using Microcontact Printing of Catalysts,” Adv. Mater. 11, 1285 (1999).
  96. H. Kind, J. M. Bonard, L. Forro, K. Kern, K. Hernadi, L. O. Nilsson, and L. Schlapbach, “Printing Gel-Like Catalysts for Directed Growth of Multiwall Carbon Nanotubes,” Langmuir 16, 6877 (2000).
  97. A. Cassell, N. R. Franklin, T. W. Tombler, E. M. Chan, J. Han, and H. Dai, “Directed Growth of Free-Standing Single-Walled Carbon Nanotubes,” J. Amer. Chem. Soc. 121, 7975 (1999).
  98. S. Y. Chou, L. Zhuang, and L. Guo, “Lithographically Induced Self-Construction of Polymer Microstructures for Resistless Patterning,” Appl. Phys. Lett. 75, 1004 (1999).
  99. E. Schäffer, T. Thurn-Albrecht, T. P. Russell, and U. Steiner, “Electrically Induced Structure Formation and Pattern Transfer,” Nature 403, 874 (2000).
  100. J. Tien, A. Terfort, and G. M. Whitesides, “Microfabrication Through Electrostatic Self-Assembly,” Langmuir 13, 5349 (1997).
  101. H. O. Jacobs and G. M. Whitesides, “Submicrometer Patterning of Charge in Thin-Film Electrets,” Science 291, 1763 (2001).
  102. S. R. Whaley, S. D. English, E. L. Hu, P. F. Barbara, and A. M. Belcher, “Selection of Peptides with Semiconductor Binding Specificity for Directing Nanocrystal Assembly,” Nature 405, 665 (2000).
  103. D. E. Ackley, M. J. Heller, and C. F. Edman, “DNA Technology for Optoelectronics,” Proceedings of LEOS'98, 11th Annual Meeting of the IEEE Lasers and Electro Optics Society, 98 CH 6243, 1998, p. 85.
  104. N. L. Jeon, J. Hu, G. M. Whitesides, M. K. Erhardt, and R. G. Nuzzo, “Fabrication of Silicon MOSFETs Using Soft Lithography,” Adv. Mater. 10, 1466 (1998).
  105. J. Hu, R. G. Beck, T. Deng, R. M. Westervelt, K. D. Maranowski, A. C. Gossard, and G. M. Whitesides, “Using Soft Lithography to Fabricate GaAs/AlGaAs Heterostructure Field Effect Transistors,” Appl. Phys. Lett. 71, 2020 (1997).
  106. L. B. Goetting, T. Deng, and G. M. Whitesides, “Microcontact Printing of Alkanephosphonic Acids on Aluminum: Pattern Transfer by Wet Chemical Etching,” Langmuir 15, 1182 (1999).
  107. J. Tate, J. A. Rogers, C. D. W. Jones, B. Vyas, D. W. Murphy, L. Wenjie, B. Zhenans, R. E. Slusher, A. Dodabalapur, and H. E. Katz, “Anodization and Microcontact Printing on Electroless Silver; Solution Based Fabrication Procedures for Low Voltage Electronic Systems with Organic Active Components,” Langmuir 16, 6054 (2000).
  108. S. T. Brittain, P. J. A. Kenis, O. J. A. Schueller, R. J. Jackman, and G. M. Whitesides, “The Use of Soft Lithography for the Fabrication of Components for Micro Electromechanical Systems (MEMS),” Abstr. Papers Amer. Chem. Soc. 216, 43 (1998).
  109. W. S. Beh, I. T. Kim, D. Qin, Y. Xia, and G. M. Whitesides, “Formation of Patterned Microstructures of Conducting Polymers by Soft Lithography, and Application in Microelectronics Device Fabrication,” Adv. Mater. 11, 1038 (1999).
  110. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, Austin, TX, 1997.
  111. J. M. Xu, “Plastic Electronics and Future Trends in Microelectronics,” Syn. Mater. 115, 1 (2000).
  112. J. A. Rogers, J. Tate, W. J. Li, Z. Bao, and A. Dodabalapur, “Printed Organic Transistors and Molded Plastic Lasers,” Israel J. Chem. 40, 139 (2000).
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