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IBM Journal of Research and Development  
Volume 43, Numbers 5/6, 1999
IBM S/390 Server G5/G6
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MCM technology and design for the S/390 G5 system - References

by G. A. Katopis, W. D. Becker, T. R. Mazzawy, H. H. Smith, C. K. Vakirtzis, S. A. Kuppinger, B. Singh, P. C. Lin, J. Bartells, Jr., G. V. Kihlmire, P. N. Venkatachalam, H. I. Stoller, and J. L. Frankel

References

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  2. G. A. Katopis and W. D. Becker, “S/390 Cost Performance Considerations for MCM Packaging Choices,” IEEE Trans. Components, Packaging, & Manuf. Technol. B: Adv. Packaging 21, No. 3, 286­297 (August 1998).
  3. W. D. Becker, H. Smith, T. McNamara, P. Muench, J. Eckhardt, M. McAllister, G. Katopis, S. Richter, R. Frech, and E. Klink, “Modeling, Simulation, and Measurement of Mid-Frequency Noise in Computer Systems,” IEEE Trans. Components, Packaging, & Manuf. Technol. B: Adv. Packaging 21, No. 2, 157­163 (May 1998).
  4. G. A. Katopis, W. D. Becker, H. H. Smith, and H. Stoller, “MCM C/D Design for the CMOS Implementation of the S/390 System,” Proceedings of the 47th Electronic Components and Technology Conference, IEEE Cat. No. 97CH36048, May 1997, pp. 479­485.
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  6. E. D. Perfecto, A. P. Giri, R. R. Shields, H. P. Longworth, J. R. Pennacchia, and M. P. Jeanneret, “Thin-Film Multichip Module Packages for High-End IBM Servers,” IBM J. Res. Develop. 42, No. 5, 597­606 (September 1998).
  7. H. Stoller, S. Ray, E. Perfecto, and T. Wassick, “Evolution of Engineering Change (EC) and Repair Technology in High Performance Multi-Chip Modules at IBM,” Proceedings of the 48th Electronic Components and Technology Conference, Seattle, WA, May 1998, pp. 916­921.
  8. R. R. Livolsi, “Variable Voltage Driver,” U.S. patent pending, Docket No. PO998062.
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  11. B. Singh, W. Becker, and M. McAllister, “Core Logic Simultaneous Switching Noise Measurements on a 500 MHz CMOS Chip on a CBGA SCM,” Proceedings of the 48th Electronic Components and Technology Conference, Seattle, WA, May 1998, pp. 605­609.
  12. B. D. McCredie and W. D. Becker, “Modeling, Measurement, and Simulation of Simultaneous Switching Noise,” IEEE Trans. Components, Packaging, & Manuf. Technol. B: Adv. Packaging 19, No. 3, 461­472 (August 1996).
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  21. G. Katopis, P. Lin, and P. N. Venkatachalam, “Coupled Noise Estimation for MCM Via Structures,” Proceedings of NEPCON West 1992, February 1992, pp. 64­76.
  22. H. H. Smith and C. T. Spring, “Coupled Noise Analysis of a Complex Connector Structure Using a Full-Wave Modeling Approach,” Proceedings of NEPCON West 1992, February 1992, pp. 29­35.
  23. H. H. Smith and G. A. Katopis, “Multireflection Algorithm for Timed Statistical Coupled Noise Checking,” IEEE Trans. Components, Packaging, & Manuf. Technol. 19, 503­511 (August 1996).

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