Biographical sketches of authors
George A. Katopis
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (katopis@us.ibm.com).
Mr. Katopis is a Senior Technical Staff Member in the IBM S/390 Division, responsible for the technology selection and packaging strategy of all CMOS S/390 servers. Mr. Katopis has authored more than fifty papers on the subjects of net design and switching-noise prediction and containment in the digital server engines. He holds three patents on switching-noise reduction and has co-authored chapters in three books on electrical design of electronic packages. Mr. Katopis received an M.S. degree and an M.Ph. degree from Columbia University. He is a Senior Member of the IEEE, and an industrial mentor to the electrical engineering departments of Cornell University and the University of Arizona at Tucson.
W. Dale Becker
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (wbecker@us.ibm.com).
Dr. Becker received his B.E.E. degree from the University of Minnesota, his M.S.E.E. degree from Syracuse University, and his Ph.D. degree from the University of Illinois. He is currently a Senior Engineer in the IBM Server Group, leading the MCM design team that integrates and implements the multiprocessor design for IBM S/390 platforms. Dr. Becker's current interests focus on the electrical design of the components that comprise a high-frequency CMOS processor system. He specializes in the application of electromagnetic numerical methods to the issues of signal integrity and simultaneous switching noise in electronic packaging, the measurement of these phenomena, and the verification of the models.
Toufie R. Mazzawy
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (tmazzawy@us.ibm.com).
Mr. Mazzawy is currently an Advisory Engineering Manager, managing the Package Design and Logic Verification teams working on the S/390 G-Series servers. Mr. Mazzawy joined IBM in 1989, and has held many positions related to MCM package design, including MCM Design Coordinator, High Level Design, Early Package Wirability Analysis, and Design Team Leader. He has received Outstanding Technical Achievement Awards for his contributions to both the G4 and G5 MCM package designs. Mr. Mazzawy received a B.E. degree in electrical engineering from the Stevens Institute of Technology in 1989 and an M.S. degree in electrical engineering from Syracuse University in 1994.
Howard H. Smith
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (smithh@us.ibm.com).
Mr. Smith received his B.S. and M.S. degrees in electrical engineering from the New Jersey Institute of Technology, Newark, in 1984 and 1985, respectively. He joined IBM in 1984 as an integrated circuit engineer at the semiconductor development laboratory in East Fishkill, New York, working in the area of high-performance masterslice designs. Mr. Smith is currently an Advisory Engineer in the IBM System/390 Division in Poughkeepsie, New York, where he is responsible for electrical analysis issues associated with high-density CMOS circuit technology and package-related products. Recent assignments have included the development and coordination of on-chip noise verification processes for the S/390 processor designs. His expertise lies in the area of electrical noise modeling and prediction in system-level computer operation. Mr. Smith has co-authored several papers on system-level noise prediction, on-chip interconnects, and electromagnetic characterization of connectors and antennas.
Charles K. Vakirtzis
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (vakirtzi@us.ibm.com).
Mr. Vakirtzis received the B.S.E.E. degree from the Rochester Institute of Technology in 1975; in addition, he has accumulated more than 30 graduate credits in the areas of theoretical mathematics and engineering. Joining IBM in 1977, he worked as a Manufacturing Engineer supporting the final system test process until 1985, when he joined the Department of Electrical Modeling of Packaging, focusing on interconnect performance and modeling. He is currently an Advisory Engineer working on the electrical modeling of noise and its containment for on-chip interconnects. Mr. Vakirtzis has co-authored a number of papers and holds two patents on noise-estimation techniques and an on-chip temperature-sensing system.
Scott A. Kuppinger
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (skupping@us.ibm.com).
Mr. Kuppinger is a Staff Engineer in the S/390 Custom Packaging Department at the IBM Poughkeepsie Development Laboratory. He joined IBM in 1989 after receiving a B.S. degree in electrical engineering at Clarkson University.
Bhupindra Singh
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (singhb@us.ibm.com).
Mr. Singh is an Advisory Engineer at the IBM Poughkeepsie Development Laboratory. He received his B.S.E.E. degree from Punjab University, Chandigarh, India, in 1966, and an M.S.E.E. degree from Syracuse University in 1978. He is currently working in advanced VLSI & Packaging Applications. Mr. Singh is involved in design, modeling, and noise simulation of high-performance multichip and single-chip packages.
Phillip C. Lin
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (linp@us.ibm.com).
Mr. Lin is a Staff Engineer working in high-performance packaging development and on-chip power grid design. He received an M.S. degree in electrical engineering from Columbia University. Mr. Lin is the author of one technical disclosure and one U.S. patent.
John Bartells, Jr.
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (barteljr@us.ibm.com).
Gregory V. Kihlmire
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (gregki@us.ibm.com).
Mr. Kihlmire is an Advisory Software Engineer. He received an A.A.S. degree in electronics from Dutchess Community College in 1975. Since joining IBM in 1977, he has worked in various positions dealing with second-level packaging, including managerial responsibility for the Module/Board Packaging and Release Department for the 3090 mainframes. Mr. Kihlmire is currently the MCM Coordinator for the Alliance packaging team.
Panangattur N. Venkatachalam
IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601 (chalam@us.ibm.com).
Mr. Venkatachalam is an Advisory Engineer at the IBM Poughkeepsie Development Laboratory. He joined IBM in 1978 at East Fishkill, New York, working in MLC MCM electrical design. In 1992 he transferred to the System/390 Division and worked on signal integrity in modules, boards, and cards. Mr. Venkatachalam received an Outstanding Technical Achievement Award for S/390 G5 Package Development in 1998. He received an M.S.E.E. degree from the University of California at Berkeley.
Herb I. Stoller
IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (stollerh@us.ibm.com).
Mr. Stoller is a Senior Engineer with the IBM Microelectronics Division, responsible for the application engineering for all high-performance MCMs. He has co-authored numerous articles and papers on the application of MCMs and MCM technology. Mr. Stoller holds eight patents and has reached the Fourth Invention Plateau. He holds a B.S. degree from CCNY and an M.S. degree from Rutgers University, both in physics.
Jason L. Frankel
IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533 (frankel@us.ibm.com).
Mr. Frankel graduated from Clarkson University in 1989 with a B.S. degree in electrical and computer engineering. From 1989 until the present, he has been a Package Design Engineer in the IBM Microelectronics Division. Since 1996, Mr. Frankel has designed the signal redistribution and power distribution structures of thin-film, glass-ceramic, and alumina multichip modules for S/390 servers.
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