Biographical sketches of authors
Gottlieb S. Oehrlein
University at Albany, State University of New York, Albany, New York 12222.
Professor Oehrlein received a Ph.D. in physics from the University at Albany in
1981. From 1982 to 1993 he was a Research Staff Member at the IBM Thomas J.
Watson Research Center in Yorktown Heights, New York. In September 1993 he
joined the faculty of the Department of Physics at the State University of New
York (SUNY) at Albany. Professor Oehrlein has published more than 150 papers
and contributed significant results on the use of low-temperature plasmas for
materials processing. These contributions were recognized with several awards
at the IBM Research Division, the 1992 Electronics Division Award of the
Electrochemical Society, and, in 1993, the 14th Thinker Award of the Tegal
Corporation.
Marcus F. Doemling
University at Albany, State University of New York, Albany, New York 12222.
Mr. Doemling is working toward his Ph.D. in the Plasma Research Laboratory at SUNY
Albany. He received a Vordiplom degree in physics from Wurzburg University in
Germany, and in 1995 an M.S. degree in physics from SUNY at Albany. He has
worked on high-density plasma etching of materials, especially photoresist. His
research is currently focused on reactive ion beam etching (RIBE) to establish
fundamental process parameters applicable to plasma-based etching processes.
Bernd E. E. Kastenmeier
University at Albany, State University of New York, Albany, New York 12222.
Mr. Kastenmeier began his study of physics at the University at Wurzburg, Germany,
in 1990. In 1993, after receiving a Vordiplom degree, he began graduate studies
in the Physics Department of SUNY at Albany. He received an M.S. degree in
physics from SUNY in 1994 and is currently working toward his Ph.D. degree. Mr.
Kastenmeier's research activities are centered around the processing of
materials using remote plasmas. He has studied the etching mechanism of
materials used in integrated-circuit manufacturing in reactive
afterglows of microwave discharges, employing surface analytical methods and
mass spectrometry. He has also improved the selective stripping of silicon
nitride and has investigated the efficiency of different F-containing gases for
the cleaning of deposition reactors.
Peter J. Matsuo
University at Albany, State University of New York, Albany, New York 12222.
Mr. Matsuo received a B.S. in physics and mathematics in 1994 and an M.S. in
physics from SUNY at Albany in 1995, after which he joined the Plasma Research
Laboratory at SUNY Albany for his doctoral studies. His research has focused on
the plasma cleaning of dielectrics and metallization layers. He is currently
the author of five published articles and one patent.
Neal R. Rueger
University at Albany, State University of New York, Albany, New York 12222.
Mr. Rueger has been working at the Plasma Research Laboratory at SUNY at Albany
since it was established in late 1993. He received a B.S. from SUNY at
Binghamton in 1983, with a major in geophysics. He received an M.S. in physics
from SUNY at Albany in 1992, and is currently completing his Ph.D. His areas of
research are high-density plasma etching of silicon dioxide, silicon, and
photoresist employing inductively coupled plasmas, as well as reactive ion beam
etching studies focused on the establishment of the fundamental details of the
plasma-etching process.
Marc Schaepkens
University at Albany, State University of New York, Albany, New York 12222.
Mr. Schaepkens is working toward his Ph.D. degree in physics in the Plasma Research
Laboratory of SUNY at Albany. He received an Ingenieur Diploma/M.S. in applied
physics from the Eindhoven University of Technology, Netherlands, in 1996, and
an M.S. in physics from SUNY Albany in 1997. His primary research projects are
the study of the mechanisms underlying selective SiO[SUB]2 etching and the
etching of high-aspect-ratio features using inductively coupled fluorocarbon
plasmas.
Theodorus E. F. M. Standaert
University at Albany, State University of New York, Albany, New York 12222.
In 1995 Mr. Standaert joined the Plasma Research Laboratory at SUNY at Albany,
where he has been studying the competitive process between fluorocarbon
deposition and etching in high-density plasmas. This study completed a
four-year education in applied physics, for which he received an Ingenieur
(Ir.) degree in 1996 from the Eindhoven University of Technology, Netherlands.
As part of his doctoral research, he has been working on the patterning of
novel low-K dielectrics and ultranarrow (~20-nm) trenches using high-density
plasmas.
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