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IBM Journal of Research and Development  
Volume 43, Numbers 1/2, 1999
Plasma processing
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High-density plasma chemical vapor deposition of silicon-based dielectric films for integrated circuits - Author bio

by S. V. Nguyen

Biographical sketch of author

Son Van Nguyen IBM Storage Systems Division, San Jose facility, San Jose, California 95193 (son1@vnet.ibm.com). Dr. Nguyen is a Senior Engineer in the IBM San Jose air- bearing surface advanced process fabrication technology group. He joined IBM in 1981 at its research and development laboratory in Essex Junction, Vermont, and has worked on advanced chemical vapor deposition and etching processes, plasma- and laser-based processes, surface tribology, and fabrication technology for both silicon integrated circuits and computer disk storage applications. Dr. Nguyen received a B.A. in chemistry in 1978 from the State University of New York at Plattsburgh, and a Ph.D. in solid-state chemistry in 1981 from Brown University. In 1980, he worked at the Exxon Research and Engineering Laboratory on catalysis for coal gasification. Dr. Nguyen has more than 44 patents issued and filed, and he has received twelve IBM Invention Achievement Awards. He has published and presented more than 88 papers in various technical journals and conferences.