IBM Skip to main content
  Home     Products & services     Support & downloads     My account  
  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
  ·  Current Issue  
  ·  Recent Issues  
  ·  Papers in Progress  
  ·  Search/Index  
  ·  Orders  
  ·  Description  
  ·  Patents  
  ·  Recent publications  
  ·  Author's Guide  
  Staff  
  Contact Us  
IBM Journal of Research and Development  
Volume 42, Number 5, 1998
Electrochemical Microfabrication
 Table of contents: arrowHTML arrowASCII   This article: arrowHTML arrowASCII
arrowCopyright info
   

Metallization by plating for high-performance multichip modules - References
by K. K. H. Wong, S. Kaja, and P. W. DeHaven

References

  1. Y. Wada, K. Sasaoka, E. Imamura, and H. Odaira, "A New Circuit Substrate for MCM-L," Proceedings of CARTS EUROPE 95, 9th European Passive Components Symposium, Amsterdam, Netherlands, 1995, pp. 94-99.
  2. P. D. Franzon, T. Conte, S. Banerjia, A. Glaser, S. Lipa, T. Schaffer, A. Stanaski, and Y. Tekmen, "Computer Design Strategy for MCM-D/Flip-Chip Technology," Proceedings of the Fifth Topical Meeting on Electrical Performance of Electronic Packaging, 1996, pp. 6-8.
  3. J. Bartley, "A User's View of MCM-D/C Packaging: Is It Worth the Trouble?" Proceedings of the 46th Electronic Components and Technology Conference, Orlando, FL, 1996, pp. 144-148.
  4. A. Iqbal, M. Swaminathan, and M. Nealon, "Design Tradeoffs Among MCM-C, MCM-D and MCM-D/C Technologies," IEEE Trans. Components Packaging & Manuf. Technol. B: Adv. Packaging 17, 22-29 (1994).
  5. T. Shimoto, K. Matsui, and K. Utsumi, "Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High Performance Multichip Modules," IEEE Trans. Components Packaging & Manuf. Technol. B: Adv. Packaging 18, 18-22 (1995).
  6. V. M. Ahmed, D. G. Berger, A. Kumar, S. J. LaMaire, K. B. Prasad, S. K. Ray, and K. H. Wong, "Selective Plating Method for Forming Integral Vias on Wiring Layers," U.S. Patent 5,209,817, May 11, 1993.
  7. P. Singer, "Making the Move to Dual Damascene Processing," Semicond. Internat. 20, 79-82 (1997).
  8. R. Jagannathan and M. Krishnan, "Electroless Plating of Copper at a Low pH Level," IBM J. Res. Develop. 37, 117-123 (1993).
  9. R. Jagannathan, R. F. Knarr, M. Krishnan, and G. P. Wandy, "Tetra Aza Ligand Systems as Complexing Agents for Electroless Deposition of Copper," U.S. Patent 5,102,456, April 7, 1992.
  10. W. H. Safranek, The Properties of Electrodeposited Metals and Alloys, 2nd Ed., American Electroplaters and Surface Finishers Society, Orlando, FL, 1996.
  11. D. S. Stoychev and M. S. Aroyo, "Influence of Pulse Frequency on the Hardness of Bright Copper Electrodeposits," Plating & Surf. Finish. 84, 26-28 (1997).
  12. M. R. Kalantary and D. R. Gabe, "Coating Thickness Distribution and Morphology of Pulsed Current Copper Electrodeposits," Surf. Eng. 11, 246-254 (1995).
  13. R. Bernards, G. Fisher, W. Sonnenberg, and E. J. Cerwonka, "Additive for Acid-Copper Electroplating Baths to Increase Throwing Power," U.S. Patent 5,051,154, September 24, 1991.
  14. B. Boudot and G. Nury, "Additive Composition Bath and Process for Acid Copper Electroplating," U.S. Patent 4,430,173, February 7, 1984.
  15. E. R. Montgomery and R. D. King, "Acid Copper Electroplating Bath Containing Brightening Additive," U.S. Patent 5,151,170, September 29, 1992.
  16. C. Madore, D. Landolt, C. Hassenpflug, and J. A. Hermann, "Application of the Rotating Cylinder Hull Cell to the Measurement of Throwing Power and the Monitoring of Copper Plating Baths," Plating & Surf. Finish. 82, 36-41 (1995).
  17. R. Rashkow and C. Nanev, "Effect of Surface Active Agents on the Initial Formation of Electrodeposited Copper Layers," J. Appl. Electrochem. 25, 603-608 (1995).
  18. S. Yoon, M. Schwartz, and K. Nobe, "Rotating Ring-Disk Electrode Studies of Copper Electrodeposition; Effect of Chloride Ions and Organic Additives," Plating & Surf. Finish. 81, 65-74 (1994).
  19. B. M. Eliash, "Method of Selectively Monitoring Trace Constituents in Plating Baths," U.S. Patent 5,298,129, March 29, 1994.
  20. R. Hac, C. Ogden, and D. Trench, "Cyclic Voltammetric Stripping Analysis of Acid Copper Sulphate Plating Baths, I. Polyether-Sulfide Based Additives, II. Sulfoniumalkanesulfonate Based Additives," Plating 63, 62-66 (1982).
  21. W. Sonnenberg, R. Bernards, P. Houle, and G. Fisher, "Method for Analyzing Organic Additives in an Electroplating Bath," U.S. Patent 5,223,118, June 29, 1993.
  22. D. R. Gabe and G. D. Wilcox, "Hull Cell," Trans. Inst. Metal Finish. 71, 71-73 (1993).
  23. S. Mehdizadeh, J. O. Dukovic, P. C. Andricacos, L. T. Romankiw, and H. Y. Cheh, "Influence of Lithographic Patterning Current Distribution in Electrodeposition: Experimental Study of Mass-Transfer Effects," J. Electrochem. Soc. 140, 3497-3505 (1993).
  24. J. O. Dukovic, "Feature-Scale Simulation of Resist Patterned Electrodeposition," IBM J. Res. Develop. 37, 125-141 (1993).
  25. C. Karakus and D. T. Chin, "Metal Distribution in Jet Plating," J. Electrochem. Soc. 141, 691-697 (1994).
  26. S. A. Amadi, D. R. Gabe, and M. R. Goodenough, "Air Agitation for Electrodeposition Process II. Experimental," Trans. Inst. Metal Finish. 72, 66-71 (1994).
  27. P. C. Andricacos, K. G. Berridge, J. O. Dukovic, M. Flotta, J. Ordonez, H. R. Poweleit, J. S. Richter, L. T. Romankiw, O. P. Schick, and K. H. Wong, "Vertical Paddle Plating Cell," U.S. Patent 5,516,412, May 14, 1996.
  28. G. White, E. Perfecto, D. McHerron, T. DeMercurio, T. Redmond, and M. Norcott, "Large Format Fabrication--A Practical Approach to Low Cost MCM," IEEE Trans. Components Packaging & Manuf. Technol. B: Adv. Packaging 18, 37-40 (1995).
  29. K. H. Wong, E. D. Perfecto, S. Kaja, G. White, C. Prasad, and T. Redmond, "Development of Electroplating Process for Large Format MCM-D," Proceedings of the Second International Symposium on Electrochemical Microfabrication, The Electrochemical Society, Miami Beach, 1995, pp. 30-34.
  30. K. W. Lee, G. F. Walker, and A. Viehbeck, "Organic Passivation of Copper for MCM Packaging," Proceedings of the SAMPE 7th International Electronic Materials and Process Conference, Parsippany, NJ, 1994, pp. 105-114.
  31. E. J. O'Sullivan, A. G. Schrott, M. Paunovic, C. J. Sambucetti, J. R. Marino, P. J. Bailey, S. Kaja, and K. W. Semkow,"Electrolessly Deposited Diffusion Barriers for Microelectronics," IBM J. Res. Develop. 42, No. 5, 607-620 (1998, this issue).
  32. R. Jikuhara and S. Tanahashi, "High Performance MCM-D Using Cu/Fluoropolymer Thin Film Multilayer Technology," Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, 1995, pp. 98-101.
  33. M. Paunovic, P. J. Bailey, R. G. Schad, and D. A. Smith, "Electrochemically Deposited Diffusion Barriers," J. Electrochem. Soc. 141,1843-850 (1994).
About IBM | Privacy | Legal | Contact