Biographical sketches of authors
Panos C. Andricacos
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights,
New York 10598 (ndricac@us.ibm.com). Dr. Andricacos is Manager of the
Electrodeposition Technology group at the IBM Thomas J. Watson Research
Center. He received B.S., M.S., and doctoral degrees in chemical
engineering from Columbia University, where he is also an adjunct associate
professor. As a postdoctoral research associate at the Lawrence Berkeley
Laboratories, he worked on fuel cells and on the application of UHV
techniques in the study of electrochemical reactions. While at IBM, he has
worked on the application of electrochemical processes in storage,
packaging, and C4 technology; he also played a key role in the development
of copper electroplating for chip metallization. In 1993 he received the
Research Award of the Electrodeposition Division, Electrochemical Society,
for the development of novel techniques for the study of alloy
electroplating.
Cyprian Uzoh IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell
Junction, New York 12533 (uzoh@us.ibm.com). Mr. Uzoh is an Advisory
Engineer/Scientist at the IBM Semiconductor Research and Development Center
(SRDC). He received his B.S. degree in metallurgical engineering from the
University of Wisconsin at Madison and his M.S. degree in materials
engineering from Rensselaer Polytechnic Institute. In 1985, he joined IBM
at the Thomas J. Watson Research Center, where he developed processes for
fabricating X-ray lithography mask membranes. For the last ten years he has
been involved in research on thin-film interfaces, high-performance
barriers, development of a low-cost metallization process for
high-performance chip interconnects, thin-film reliability, process
integration, and equipment design.
John O. Dukovic
IBM Research Division, Thomas J. Watson Research Center,
P.O. Box 218, Yorktown Heights, New York 10598 (dukovic@us.ibm.com).
Dr. Dukovic received a B.S. in chemical engineering from Case Western Reserve University in 1980
and a Ph.D. in chemical engineering from the University of California at
Berkeley in 1986. Since joining IBM in 1986, he has worked primarily on
mathematical models, reactor design, tool engineering, and process control,
in support of electrodeposition processes for magnetic recording heads,
packaging modules, flip-chip interconnections, and copper chip wiring. He
has been an Adjunct Assistant Professor of Chemical Engineering and Applied
Chemistry at Columbia University. Dr. Dukovic is currently Manager of
Silicon Processing and Operations in the Advanced Semiconductor Technology
Laboratory at the Thomas J. Watson Research Center. He is chairman of the
Electrodeposition Division of the Electrochemical Society.
Jean Horkans
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218,
Yorktown Heights, New York 10598 (horkan@us.ibm.com). Dr. Horkans is a
Research Staff Member at the IBM Thomas J. Watson Research Center working
in the field of microelectronics manufacturing research. Her main interests
are electrochemistry and electrodeposition. She joined IBM at the Watson
Research Center in 1973 after having received a B.A. in chemistry from St.
Olaf College and a Ph.D. in chemistry from Case Western Reserve University.
She received an IBM Outstanding Technical Achievement Award in 1982 for
development of electrochemical monitors and a Research Division Award in
1991 for contributions to magnetic disks. Dr. Horkans is a member of the
Electrochemical Society and the New York Academy of Sciences.
Hariklia Deligianni
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights,
New York 10598 (lili@us.ibm.com). Dr. Deligianni is an Advisory Engineer at
the IBM Thomas J. Watson Research Center. She received a Ph.D. degree in
chemical engineering from the University of Illinois at Urbana-Champaign in
1988. She was hired at IBM Research that same year and worked as a
Postdoctoral Fellow on the electrodeposition mechanism of magnetic
materials. Since 1990, she has worked on C4 and Cu interconnections both at
IBM Research and at the East Fishkill Semiconductor Research and
Development Center. Dr. Deligianni's interests include electrodeposition of
metals, mathematical modeling of semiconductor processes, and process
integration. She has co-authored about 20 publications and four patents.
|
HTML