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Technology shifts and market forces are changing the composition and design of storage systems. Topics for this diverse issue include the emergence of nonvolatile storage technologies, virtualization technologies that reduce the distinction between storage and computing platforms, advances in tape densities, the growing use of commodity and distributed storage, and the increasing importance of error and disaster recovery, autonomic storage management, petascale file and archival storage, and long-term data preservation.
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Historically, the steady growth of computer system performance depended on the performance of microprocessors, which depended on the scaling of devices and circuits to smaller dimensions. As scaling on the 2D surface of chips approaches practical limits, 3D technologies offer an opportunity for continued system improvements, even as the progress of scaling slows down. The eight papers in this issue describe the system design opportunities and challenges of 3D chip technology, as well as methods for producing dense arrays of through-silicon vias, thinned silicon, dense area-array silicon–silicon interconnection, chip stacking, and 3D wafer integration. Thermomechanical modeling and the implementation of 3D structures in products are also described.
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Since the first publication of the IBM Journal of Research and Development in 1957 and the IBM Systems Journal in 1962, these Journals have provided descriptions and chronicles of many important advances in information technology and related topics ranging from atoms to business solutions. To celebrate the 50th anniversary of the IBM Journals, this report highlights a selection of significant papers published in the Journals, along with brief commentaries. The Journal editors chose papers which were very highly cited in the technical literature, described technologies of historic significance, or provided an important overview of a field.
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