Packaging design challenges of the IBM System z10 Enterprise Class server
by T.-M. Winkel
H. Harrer
D. Kaller
J. Supper
D. M. Dreps
K. L. Christian
D. Cosmadelis
T. Zhou
T. Strach
J. Ludwig
and D. L. Edwards
This paper describes the system packaging and technologies of
the IBM System z10™ high-end Enterprise Class server. This
machine exceeds the multiprocessor performance of the previous
system by 50%. A new generation of the IBM Elastic Interface was
developed in order to maintain the increased interconnect signal
speed of up to 2.93 Gb/s. Power control and power delivery to the
multicore processors were a special challenge for the server
packaging because of the high currents and the high number of
voltage domains.
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